How to disassemble electronic component?

Last Update Time: 2019-01-12 15:53:31

In the disassembly process, the main tools are : electric iron, suction gun, tweezers and so on.

Disassembly method

1.Disassembly of hand inserted components

 

1) A small pin dismantling method: one hand with an electric soldering iron is heated to be dismantled, and the one hand is clamped with tweezers. When the solder joints are melted, the components are gently pulled out with the clamp.

 

2)The method of dismantling the components with multiple solder joints and hard pins: using a tin suction device or a tin suction gun to dry the soldered tin out of the pin one by one, and then taking out the components with a clip.

 

With the aid of tin absorbing material (such as woven wire, tin copper net) on the pin of the component, the tin material is drawn out after heating with the soldering iron and flux, and the solder is taken out together, and the components are taken out finally.

 

2. Disassembly of machine insert components

Hold the iron in the right hand to melt the tin point, and continue to heat the tin point. The left hand holds the tweezers, and the angle is aligned to the tin point, then clamped and straightened

After using tin gun or tin suction device to absorb the solder, the tweezers are used to break the pins and remove the components.

 

For the double or four column flat package IC, the patch welding components can be dismantled with a hot air gun, the temperature is controlled at 350 °C, the air volume is controlled in the 3~4 lattice, the hot wind is blown vertically and evenly to the pin, while the tip of the tweezers is leaned on the one angle of the integrated circuit, and when all the soldering tin is melted, the IC is gently removd by the tweezers tip.