109X9812H0016

Series:	San Ace MC
Part Status:	Active
Type:	Board Level
Package Cooled:	Pentium® III & Pentium® 4
Attachment Method:	Clip
Shape:	Rectangle
Length:	3.740" (95.00mm)
Width:	3.606" (91.60mm)
Diameter:	--
Height Off Base (Height of Fin):	2.460" (62.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	0.42°C/W
Thermal Resistance @ Natural:	--
Material:	Aluminum, Plastic
Material Finish:	--

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Thermal Heat SinksThermal heat sinks are an essential part of any high-performance computing system or device. They enable the processor to maintain its temperature by dissipating heat that is generated during operation. Heat sinks are also employed to protect the processor from thermal damage due to high temperatures.The 109X9812H0016 heat sink is a specifically designed component with multiple features to maximize cooling performance. This heat sink uses a pin-fin technology that utilizes high-density, highly conductive aluminum pins to dissipate heat quickly and efficiently. The pins create an enlarged surface with a greater area for heat dissipation, which is particularly effective at high-powered applications.Notably, the 109X9812H0016’s design offers a greater level of customization over traditional heat sinks. This heat sink can be adjusted, configured, and fitted easily to providing superior performance with existing hardware. The design also includes integral memory slots for additional cooling options, allowing for optimal cooling without significant alterations to the case or additional fans.As with all thermal heat sinks, the 109X9812H0016 is designed to transfer heat from a processor or other hot component to a cooler surrounding area. Heat is exchanged by thermal conductivity through the sink’s metal pins and fins, which are embedded within a heat conductive base. Its shape assists in the thermal heat transfer process by increasing the surface area that comes in contact with the processor and the air.In addition to dissipating heat quickly, the innovative pin-fin technology used by the 109X9812H0016 also helps maintain silence and minimize noise, thus without interfering with work or process. Furthermore, its size is optimized for selective applications, allowing for greater thermal relief and less hardware modification.In summary, the 109X9812H0016 heat sink should be considered as an ideal choice by those who are keen on keeping their hardware running at its maximum performance, and also taking every measure to conserve cooling space within the case. Its excellent cooling properties, as well as its adaptability and flexibility, make it a great choice for workstations, servers, and devices that require superior thermal performance.

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