109X9912S0016

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Thermal - Heat Sinks

109X9912S0016 is a solid state passively cooled device that is designed to transfer heat created in one component or device and dissipate it away from an area where it can cause issues. It is an inexpensive thermal management solution for the spread of electronic and electrical devices in a wide range of applications. The 109X9912S0016 has been used in the distribution of heat generated in semiconductor-based products, such as optical and digital circuit boards. Additionally, it has been employed in the cooling of high-efficiency LEDs and in the heat dissipation from high-performance gaming racks.

Application field

The 109X9912S0016 is a passive cooling device that is suitable for cooling very large and small components and devices such as RF amplifiers, transceivers, and other applications. It can also be employed in the distribution of heat generated in telecom racks, battery packs, and power supplies, as well as being used in the cooling of laser diodes and high-power computer memory.

It is an ideal solution for cooling components in electronic circuits, including telecommunications, computing, medical, automotive, aerospace, and consumer electronics.

Working Principle

The 109X9912S0016 is a passive cooling device that does not require the use of a fan. It uses a combination of a thermally conductive aluminum base plate, a thermal adhesive, and a thermal foam or rubber to create a uniform thermal conduction to move excess heat away from the component or device to be cooled. The thermal adhesive is applied to the base plate before it is placed onto the component to spread the heat evenly across the surface of the component.

The thermal foam or rubber is then placed between the component and the base plate. This provides a cushion for the base plate and helps to direct the heat away from the component. The entire system is designed to provide an efficient way to spread the heat away from the component or device and dissipate it.

The 109X9912S0016 uses a combination of modern materials and technologies to provide an effective and efficient thermal spread and dissipation. It is a cost-effective solution and is suitable for a wide range of applications that require the efficient transfer and dissipation of heat.

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