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Allicdata Part #: | 109X9912T0S016-ND |
Manufacturer Part#: |
109X9912T0S016 |
Price: | $ 26.24 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Sanyo Denki America Inc. |
Short Description: | P4,CELERON,1.7-3.4GHZ,FC-PGA2 |
More Detail: | Heat Sink Pentium® III & Pentium® 4 Aluminum, Plas... |
DataSheet: | ![]() |
Quantity: | 1000 |
24 +: | $ 23.61290 |
Series: | San Ace MC |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | Pentium® III & Pentium® 4 |
Attachment Method: | Clip |
Shape: | Rectangle |
Length: | 3.740" (95.00mm) |
Width: | 3.543" (90.00mm) |
Height Off Base (Height of Fin): | 2.441" (62.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 0.30°C/W |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum, Plastic |
Material Finish: | -- |
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Thermal - Heat Sinks
The regular usage of thermal transistors in high power electronic systems has brought forth an efficacy for dissipating heat and improving cooling system. The application of the thermal transfer devices, or better known as heat sinks, provide improved energy performance as they facilitate the transfer of heat. One of the most commonly used heat sink is model number 109X9912T0S016.
Application
The 109X9912T0S016 heat sinks are primarily used in electric devices that need to dissipate heat in order to maintain the efficiency and support extended usage. Commonly used in electronic components such as amplifier, motors, and transistors, the heat sinks show profound significance in chip-level package in managing thermal issues. The high thermal resistance provides improved thermal efficiency.
Structure
The 109X9912T0S016 heat sinks come with a construction consisting of corrugated aluminum fins that can transfer heat effectively to the ambient environment. This ensures that the maximum surface area contact with ambient environment and significantly improves the thermal performance of the device. The extruded aluminum base also provided good base thermal performance.
Working Principle
The 109X9912T0S016 heat sinks are designed to transfer heat from the component to the environment. Using heat pipes, thermal insulation, and the aluminum fins, the heat is conducted into the heat sink. The corrugated fins give greater surface area contact with the ambient air, allowing for better heat transfer. The heat is then dissipated to the environment through convection and natural air cooling. The fins, heat pipes, and aluminum base work together to reduce the rate of temperature build-up inside the component, thus keeping it cool and in good working order.
Advantages
The primary advantage of the 109X9912T0S016 heat sink is its high thermal efficiency - making it ideal for cooling components that generate a lot of heat. It also has a low installation cost and is easy to install, making it a great heat sink for beginners. It features an extruded aluminum base that operates with low noise and vibration, rendering a good heat sink design. Lastly, it features excellent environmental resistance which makes it a good choice for most electronic components.
Conclusion
The 109X9912T0S016 heat sinks provide highly effective thermal management by dissipating heat through a combination of aluminum fins and an extruded aluminum base. It is a reliable and efficient way to keep electronics cool, allowing them to last longer and function better. The 109X9912T0S016 heat sink is suitable for a wide variety of applications, and its low cost and high thermal efficiency have made it a popular choice among electronic component makers.
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