342946 Allicdata Electronics
Allicdata Part #:

HS483-ND

Manufacturer Part#:

342946

Price: $ 27.12
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: COPPER HEATSINK 60X60X22MM
More Detail: Heat Sink BGA Copper Top Mount
DataSheet: 342946 datasheet342946 Datasheet/PDF
Quantity: 84
1 +: $ 24.65190
10 +: $ 23.20420
25 +: $ 21.75390
50 +: $ 20.30360
100 +: $ 19.57850
250 +: $ 18.49090
Stock 84Can Ship Immediately
$ 27.12
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.866" (22.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 0.80°C/W @ 300 LFM
Thermal Resistance @ Natural: 7.20°C/W
Material: Copper
Material Finish: AavSHIELD 3C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are used to dissipate heat away from sensitive components (e.g. chips) which could otherwise be damaged by the heat. A heat sink consists of a metal or plastic body with fins on its surface. The fins act as a large area to dissipate the heat. By dissipating the heat away from the component, the component is able to withstand higher temperatures or operate at a higher speed.

The 342946 application field and working principle of a heat sink are based on the basic principles of thermal dynamics, which states that heat will naturally move from high temperature areas to low temperature areas. By placing a thermally-conductive metal between the component and the surrounding air, the heat can be moved away from the component to the ambient air. The fins on the heat sink help to increase the surface area of the heat sinks, allowing more air to come into contact with the heat sink and dissipate the heat away faster.

There are several factors which must be taken into account when designing a heat sink. These include the thermal conductivity of the material, the surface area of the heat sink, the air flow around the heat sink, and the size and shape of the heat sink. The thermal conductivity of the material will determine how efficient the heat sink is at dissipating the heat, and the surface area will allow for more air to come into contact with the heat sink, increasing the rate of heat dissipation. The air flow must also be considered, as air cannot pass through a heat sink if it is not open to the air.

The size and shape of the heat sink will also affect its efficiency. A larger, more square heat sink will have more surface area, and will be able to dissipate heat more quickly. However, heat sinks with a larger surface area can also be more difficult to install, and can be more expensive. Therefore, a balance between size, shape, and cost must be taken into account in order to select the most efficient heat sink for the application.

In addition to the considerations above, the type of heat sink must also be chosen carefully. Different types of heat sinks are available, designed to dissipate different amounts of power, or to suit certain applications. Common types of heat sinks include flat-panel heat sinks, finned heat sinks, pin-fin heat sinks, and heat pipe heat sinks. Each of these types has its own advantages and disadvantages, and their suitability must be confirmed for the intended application.

Heat sinks are essential components for systems that rely on high-powered components. By dissipating the heat away from the chip or component, these components are able to operate reliably, and in some cases, at a higher speed. The 342946 application field and working principle of heat sinks are based on the principles of thermal dynamics, and the correct selection and application of heat sinks are essential for the components to function correctly.

The specific data is subject to PDF, and the above content is for reference

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