530101B00150G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-218
Attachment Method:	Clip and Board Mounts
Shape:	Square, Fins
Length:	1.750" (44.45mm)
Width:	0.490" (12.44mm)
Diameter:	--
Height Off Base (Height of Fin):	1.750" (44.45mm)
Power Dissipation @ Temperature Rise:	4.0W @ 30°C
Thermal Resistance @ Forced Air Flow:	1.50°C/W @ 400 LFM
Thermal Resistance @ Natural:	6.30°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat SinksHeat sinks are a key component in the optimization of thermal design for any device. By providing efficient cooling to all heat-sensitive components, heat sinks can increase the longevity of any electronic device, saving energy and reducing the risk of damage or malfunctions. The 530101B00150G thermal heat sink is an innovative solution for most electronic components, combining portability and high-efficiency cooling.The 530101B00150G thermal heat sink is made up of aluminum alloy construction that has been coated with a corrosion-resistant chrome finish. This provides excellent thermal performance, dissipating heat quickly and accurately. The heat sink uses a three-layer sectional design design to allow for a wide range of heat dissipation angles. This design offers one-direction flow of air for optimal cooling, to both the central component and heat sink itself.The thermal heat sink features two heat pipes, which transfer heat away from the area where cooling is most needed, while preventing turbulence and increases the efficiency of the heat sink. The heat pipes serve as an intermediary between the two layers of the heat sink, allowing for an optimized performance. These heat pipes also reduce the amount of energy wasted in heat transfer, leading to increased efficiency and improved device performance.The 530101B00150G thermal heat sink also has an adjustable fan speed, allowing it to control the amount of heat dissipated. This feature is particularly useful when cooling components that require a larger amount of heat to be dissipated, such as processors or video cards. This flexibility allows it to be used in most applications, including industrial, commercial, and consumer electronics.In demanding applications, such as gaming PCs or distributed computing environments, an additional feature of the thermal heat sink is its ability to regulate fan speed and air flow automatically. This ensures that the correct levels of cooling is being applied to the components, while also helping to reduce the amount of noise from the fan.The 530101B00150G thermal heat sink is designed to provide performance and reliability in a small form factor design. This makes it ideal for applications that require thermal management while also saving space. It is an ideal choice for applications where cooling needs require a small but highly efficient solution that is both cost effective and reliable.

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