Allicdata Part #: | 533502B02552G-ND |
Manufacturer Part#: |
533502B02552G |
Price: | $ 1.18 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 Aluminum 6.0W @ 30°C Board Level,... |
DataSheet: | 533502B02552G Datasheet/PDF |
Quantity: | 1000 |
2500 +: | $ 1.06060 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Clip and PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 6.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 1.00°C/W @ 800 LFM |
Thermal Resistance @ Natural: | 4.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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A heat sink is an essential part of many modern electronic circuits, because it dissipates heat from the components and makes sure they don\'t overheat. The 533502B02552G is a thermal heat sink used for high-power dissipating components, such as CPUs, GPUs, power amplifiers and switching power supplies. It is a cost-effective choice for many applications, as it is made of higher strength aluminum and is highly efficient at dissipating heat.
The 533502B02552G heat sink features two rows of fins with two different shapes and sizes for improved heat dissipation. The fins are designed with a curve shape and a wavy pattern to increase surface area and maximize heat transfer, and the base plate is insulated to help reduce heat absorption. This heat sink also comes with a thermal adhesive and four mounting clips for easy installation.
The working principle of the 533502B02552G heat sink is based on thermodynamics. It relies on the fact that heated components need to transfer energy in order to remain at a constant temperature. As the heated component radiates energy, it passes through the heat sink and is absorbed by the fins, which then dissipate the energy into the air. This process of exchanging energy between the component and the environment helps keep the component from overheating.
The 533502B02552G heat sink is widely used in many electronic applications. It is suitable for high wattage components, such as CPUs, GPUs, power amplifiers and switching power supplies. In addition, it can be used for cooling various components found in consumer and industrial electronics, including printers, computers, LED drivers and more. It is also often used with fans to further increase cooling performance.
Overall, the 533502B02552G heat sink is an effective and efficient way to keep high-power components cool, while ensuring maximum heat dissipation. It is a cost-effective choice for many applications, as it is made of higher strength aluminum and is highly efficient at dissipating heat. In addition, it is also easy to install and is compatible with a wide range of electronic components.
The specific data is subject to PDF, and the above content is for reference
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