533701B02552G Allicdata Electronics
Allicdata Part #:

533701B02552G-ND

Manufacturer Part#:

533701B02552G

Price: $ 0.95
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEAT SINK
More Detail: Heat Sink
DataSheet: 533701B02552G datasheet533701B02552G Datasheet/PDF
Quantity: 1000
3250 +: $ 0.84760
Stock 1000Can Ship Immediately
$ 0.95
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat Sinks are commonly used in a wide variety of applications where heat must be dissipated from a particular object or area. 533701B02552G is a type of Thermal Heat Sink that is used in many different types of systems in order to help manage the temperature of hot components, such as processors, GPU\'s, ICs, etc.

The 533701B02552G Thermal Heat Sink is a mechanical device that is designed to help absorb heat and reduce the temperature of a hot component in a system. It works on the principle of conduction, in which thermal energy is transferred between two objects by direct contact. Heat sinks use this principle to help dissipate the heat generated by the component by conducting the heat away from the object and into the nearby medium (usually air or liquid).

The 533701B02552G is available in various sizes and configurations, allowing it to be used in many different types of applications and systems. It is best suited for applications where a large amount of heat needs to be dissipated quickly, such as processors, GPUs, and ICs, to ensure that the temperature of the components does not exceed the upper temperature limit and damage the component. It is also suitable for applications where the cooling needs to be done quietly, as the heat sink is designed to be completely silent during operation.

The 533701B02552G Thermal Heat Sink features a metal fin array design that is designed to maximize surface area in order to take advantage of the larger amount of surface area alloed by the fin array. This allows a larger area for heat dissipation which results in a higher thermal rating and therefore more efficient cooling. The sink also features a copper base plate, which aids in heat transfer from the component to the fins of the heat sink.

The 533701B02552G Thermal Heat Sink also features a unique clip-on design, which makes installation and removal of the heat sink quick and easy. It also includes a locking clip which prevents the sink from slipping out of place during operation. The sink is also designed to be compatible with a variety of mounting solutions, such as screws, bolts, and clips, allowing it to be quickly and easily installed in applications where limited space is available.

The 533701B02552G Thermal Heat Sink is a reliable and efficient way to dissipate heat from hot components in a variety of applications. Its unique design and features make it an excellent choice for thermal management and cooling solutions. In addition, its clip-on design makes it easy to install and remove, while its locking clip ensures the sink stays in place. The large surface area of the fin array also allows for more efficient cooling, making it an excellent choice for applications where heat dissipation needs to be done quickly and quietly.

The specific data is subject to PDF, and the above content is for reference

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