566902B00000G Allicdata Electronics
Allicdata Part #:

566902B00000G-ND

Manufacturer Part#:

566902B00000G

Price: $ 0.45
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220, TO-262 Aluminum 2.0W @ 40°C Boar...
DataSheet: 566902B00000G datasheet566902B00000G Datasheet/PDF
Quantity: 1000
10000 +: $ 0.40541
Stock 1000Can Ship Immediately
$ 0.45
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220, TO-262
Attachment Method: Clip
Shape: Rectangular, Fins
Length: 0.850" (21.59mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are integral components of technical infrastructure that regulate and dissipate heat from electrical components to maintain their optimum operating temperatures. The 566902B00000G is a standard thermal-heat sink that is readily available in the market and is an ideal choice for a range of applications.

The 566902B00000G thermal-heat sink is made from a copper alloy for superior heat conductivity. It is ideal for dissipating heat from both small and medium-sized electrical components that don’t require an active cooling system. The small size and lightweight of the 566902B00000G makes it suitable for installation into a range of confined spaces. It also features a thin profile for easy integration into any PCB compactly and without adding any additional bulk.

The working principle of the 566902B00000G thermal-heat sink is simple yet effective. When the device is in use, the thermal conductivity of the P.C.B. passes heat from the component to the 566902B00000G. This heat is then radiated through the process of convection which dispels the heat away from the components into the surrounding air. This helps to maintain safe operating temperatures for the components and reduces thermal runaway.

The 566902B00000G thermal-heat sink offers a range of advantages in both performance and cost. The copper alloy construction used in this thermal-heat sink results in superior thermal conductivity of up to 5.5 W/m˚C, as well as radiation at a rate of 64 W/m˚C. This helps to efficiently dissipate heat away from components to cool them effectively. The increased contact area of the heat sink further ensures that heat is quickly radiated away ensuring maximum cooling efficiency. As the 566902B00000G is sold in large volumes, bulk discounts are also available, making it an affordable choice for any application.

The 566902B00000G thermal-heat sink is ideal for a range of applications that require efficient heat dissipation of small or medium-sized components. Its small size and lightweight make it suitable for installation into a range of confined spaces, while its thin profile allows it to fit into any PCB without adding bulk. Its superior thermal conductivity and radiation ensures efficient cooling of components while its cost-efficient pricing makes it an ideal choice for any application.

The specific data is subject to PDF, and the above content is for reference

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