566902B04000G Allicdata Electronics
Allicdata Part #:

566902B04000G-ND

Manufacturer Part#:

566902B04000G

Price: $ 0.57
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220, TO-262 Aluminum 2.0W @ 40°C Boar...
DataSheet: 566902B04000G datasheet566902B04000G Datasheet/PDF
Quantity: 1000
10000 +: $ 0.50846
Stock 1000Can Ship Immediately
$ 0.57
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Shape: Rectangular, Fins
Length: 0.850" (21.59mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks

Thermal - heat sinks are a critical component of many modern electronic devices. They are used to help manage the heat generated by the device and protect its electronic components from being damaged. The 566902B04000G heat sink is a good example of how these devices work and the various applications they can be used for.

The 566902B04000G heat sink is a type of folded fin heat sink. It is made from aluminum alloy with a length of 50mm, width of 48.7mm, and a height of 10mm. The heat sink features stamped, folded fins which are spaced evenly to increase surface area and promote heat dissipation. The fins are also designed to act as turbulence promoters, helping to increase air flow. This helps to speed up the cooling process and limit the temperature of the electronic components.

The main purpose of the 566902B04000G heat sink is to provide thermal management for electronic devices. It can be used in a wide range of applications, including in power supplies, motor controllers, medical instruments, and the telecommunications industry. The device is also suitable for small devices, such as microprocessors, where a more compact heat sink is required. In these cases, the device is often used with a fan to help increase air flow and further reduce the operating temperature.

The 566902B04000G heat sink works by absorbing heat from the electronic components and dissipating it into the air. This process is known as convection. Heat is transferred from component to component via conduction until it reaches the surface of the heat sink. It is then moved away from the components by the air flowing over the fins. The fins are designed to create a turbulent effect that subtracts heat from the components more quickly and more efficiently than other heat dissipating solutions.

The 566902B04000G heat sink is an effective and reliable thermal management device. It is lightweight, highly efficient, and designed to perform consistently over a long period of time. Its robust construction makes it suitable for use in a wide range of applications and ensures it is able to withstand extreme environmental conditions. The device is also cost effective, making it a popular choice for many industries.

Overall, the 566902B04000G heat sink is an ideal solution for many thermal management applications. It is easy to install, highly efficient, and designed to withstand harsh environmental conditions. Its robust construction makes it suitable for use in a wide range of applications and ensures it is able to provide reliable cooling performance. The device is also cost effective, making it an ideal choice for many industries.

The specific data is subject to PDF, and the above content is for reference

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