573100D00010G Allicdata Electronics

573100D00010G Fans, Thermal Management

Allicdata Part #:

573100D00010GTR-ND

Manufacturer Part#:

573100D00010G

Price: $ 0.55
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK SMT D-PAK/TO-252 TIN
More Detail: Heat Sink TO-252 (DPak) Copper 0.8W @ 30°C Top Mou...
DataSheet: 573100D00010G datasheet573100D00010G Datasheet/PDF
Quantity: 16250
250 +: $ 0.50017
500 +: $ 0.47074
1250 +: $ 0.42661
6250 +: $ 0.41189
12500 +: $ 0.38247
Stock 16250Can Ship Immediately
$ 0.55
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: TO-252 (DPak)
Attachment Method: SMD Pad
Shape: Rectangular, Fins
Length: 0.315" (8.00mm)
Width: 0.900" (22.86mm)
Diameter: --
Height Off Base (Height of Fin): 0.400" (10.16mm)
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Material: Copper
Material Finish: Tin
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical when it comes to the effective operation and longevity of electrical and electronics components and equipment. Heat sinks are a vital component in the process of removing excess heat from devices, so it is essential that the right type of heat sink is selected for the application at hand. The 573100D00010G is a thermal management product that falls into the thermal - heat sink category and provides a number of impressive features and benefits.

The 573100D00010G is an Extruded Aluminum Heat Sink manufactured from a seamless extrusion of high purity aluminum alloy. It is designed for current and future electronic applications and uses a single piece extrusion of aluminum alloy 6063-T5 with a thermal conductivity rating of 164W/m-K. The 573100D00010G is designed with a recessed cross-section surface which greatly increases the effectiveness of its cooling ability by providing a higher thermal mass and larger surface area for faster cooling. This heat sink also features a surface area of 21470 cm2 which allows for greater heat transfer.

The 573100D00010G is an incredibly effective solution for heat dissipation, capable of dissipating heat up to 75W depending on the airflow around the heat sink. This heat sink also offers excellent dielectric performance up to 20GHz. This allows for a wide range of applications such as high-end processors, graphics cards, and other electronic components with high power requirements.

The 573100D00010G is designed to be used in a range of different types of applications including LED lighting, power supplies and other high-end electronic equipment and components. The heat dissipation provided by this heat sink is far superior compared to passive solutions that rely on convection cooling, making it an ideal choice for applications where cooling is of the utmost importance. In addition, the 573100D00010G is also designed to protect the electronic components from shock and vibration, further ensuring their reliability and long-term performance.

The 573100D00010G is incredibly easy to install and has a design that allows for quick and easy heat dissipation. The extruded aluminum design of the 573100D00010G also makes it incredibly durable and resistant to extreme temperatures. This heat sink is also very cost-effective, providing an excellent value for money solution when compared to other available alternatives.

The 573100D00010G is one of the best thermal management solutions available on the market. It is designed to ensure maximum heat dissipation, with excellent dielectric performance and a wide range of applications. This makes the 573100D00010G a great choice for those looking for an effective and reliable heat sink for their thermal management requirements.

The specific data is subject to PDF, and the above content is for reference

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