7025S45PF Allicdata Electronics
Allicdata Part #:

7025S45PF-ND

Manufacturer Part#:

7025S45PF

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: IDT, Integrated Device Technology Inc
Short Description: IC SRAM 128K PARALLEL 100TQFP
More Detail: SRAM - Dual Port, Asynchronous Memory IC 128Kb (8K...
DataSheet: 7025S45PF datasheet7025S45PF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Volatile
Memory Format: SRAM
Technology: SRAM - Dual Port, Asynchronous
Memory Size: 128Kb (8K x 16)
Write Cycle Time - Word, Page: 45ns
Access Time: 45ns
Memory Interface: Parallel
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)
Base Part Number: IDT7025
Description

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The 7025S45PF model is a high-density and high-speed 256Mbit low-power memory ASIC (Application Specific Integrated Circuit) used in a wide range of memory applications. It is part of a family of similar ASICs from the same manufacturer, and is used in both consumer and industrial applications. The 7025S45PF offers low power consumption, high performance, and high integration density, making it an ideal choice for applications that require large amounts of memory capacity.

The 7025S45PF is a standard architecture with a 64-bit interface and is suitable for both synchronous and asynchronous operations. It consists of four layers, each of which consists of four banks with separate row and column access. It is designed to support maximum data transfer rate of up to 350Mbit/s across all four banks, making it suitable for use in applications that require high performance. On the power consumption side, the 7025S45PF is designed to consume less than 12 mW when fully operating at its operating speed of up to 350Mbit/s.

The 7025S45PF ASIC is ideal for use in applications that require high integration density, such as embedded memory controllers, microcontrollers, and graphics chips. It is also suitable for use in applications that require large capacity, such as high performance data storage devices. Its high integration density and low power consumption make it an ideal choice for these types of applications.

In terms of working principle, the 7025S45PF uses a technique known as Multi-Bank Access Interface (MBAI). This is a method of accessing multiple banks within a single memory device simultaneously. This technique allows for higher performance and reduces system latency. The ASIC\'s banking module supports an asynchronous interface and provides a flexible and efficient way to access different banks and groups of memory.

The 7025S45PF\'s banking module also supports a number of features to help ensure data security, such as on-the-fly error correction, a redundant error correction code (ECC) mechanism, and advanced power down capability. It also provides features such as burst read and boot-up protection. The ASIC\'s banks also support advanced features, such as the ability to open and close groups of memory as well as multiple banks.

Overall, the 7025S45PF is a high performance and high density memory ASIC that is ideal for use in a wide range of memory applications, including high integration density, low power consumption, and high performance. With its high performance and low power consumption, the 7025S45PF is an ideal solution for a variety of memory related applications.

The specific data is subject to PDF, and the above content is for reference

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