70T3399S200BC Allicdata Electronics
Allicdata Part #:

70T3399S200BC-ND

Manufacturer Part#:

70T3399S200BC

Price: $ 66.08
Product Category:

Integrated Circuits (ICs)

Manufacturer: IDT, Integrated Device Technology Inc
Short Description: IC SRAM 2M PARALLEL 256CABGA
More Detail: SRAM - Dual Port, Synchronous Memory IC 2Mb (128K ...
DataSheet: 70T3399S200BC datasheet70T3399S200BC Datasheet/PDF
Quantity: 1000
12 +: $ 60.07050
Stock 1000Can Ship Immediately
$ 66.08
Specifications
Write Cycle Time - Word, Page: --
Base Part Number: IDT70T3399
Supplier Device Package: 256-CABGA (17x17)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.4 V ~ 2.6 V
Memory Interface: Parallel
Access Time: 3.4ns
Series: --
Clock Frequency: 200MHz
Memory Size: 2Mb (128K x 18)
Technology: SRAM - Dual Port, Synchronous
Memory Format: SRAM
Memory Type: Volatile
Part Status: Active
Packaging: Tray 
Description

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Today\'s communication systems are relying more and more on high speed digital components, among which 70T3399S200BC memory devices, developed by Samsung, play an important role due to their advanced performance, high capacity and reliability. 70T3399S200BC memory devices are an important part of Samsung\'s SDRAM family, with their general application field mainly comprising circuit board, communication and aerospace engineering. This article will provide an overview of the general application field and working principle of 70T3399S200BC memory devices.

70T3399S200BC memory devices are high-performance, dynamic random access memories (DRAM) compatible with the 200-pin and 400-pin FLEX™ SDRAM packages. These devices are designed for applications requiring extremely high frequency operation, such as CUBEHAWK™ II, P-MOS™, FLITE™. Featuring up to 8 gigabit densities, 70T3399S200BC memory devices provide high memory interface and data line speeds of up to DDR-II 800/1600/1866/2100 MHz. In addition, they provide advanced performance features such as fast random access and write recovery times. Moreover, these devices provide superior refresh and refresh strategy capabilities which reduce power dissipation and enhance system performance.

Applications of 70T3399S200BC memory devices are mainly found within boards that require high-performance digital components. These devices are used in server boards, communication boards, and network interface boards for high speed data transfers. In addition, these memory devices are also used in storage systems, and in aerospace engineering, such as in the processing of radar signals and in the control systems of missiles and satellites.

The working principle of 70T3399S200BC memory devices is based on a device called an accumulator and a multiplexer. The accumulator is a three-state device that stores the data, while the multiplexer is used to route the data to the accumulator in a selected order. Whenever an instruction is given to read or write data, the accumulator’s output is fed to the address line and the multiplexer selects data from the data bus, depending on the address given. Once selected, the data is transferred to the accumulator for storage, and then passed to the output. By repeating this process, multiple sets of data can be processed rapidly and stored in the accumulator.

In conclusion, 70T3399S200BC devices are high-speed dynamic random access memories (DRAM) designed for general applications requiring extremely high performance, such as boards requiring digital components, communication boards, and aerospace engineering. Furthermore, these devices have a working principle based on an accumulator and a multiplexer, which enables them to rapidly process multiple sets of data and store them in the accumulator.

The specific data is subject to PDF, and the above content is for reference

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