821502B00000 Allicdata Electronics
Allicdata Part #:

CR482-ND

Manufacturer Part#:

821502B00000

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 9.5X19X19MM
More Detail: Heat Sink TO-220 Aluminum 1.0W @ 30°C Board Level
DataSheet: 821502B00000 datasheet821502B00000 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Width: 0.750" (19.05mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

821502B00000 Thermal - Heat Sinks are essential components of modern computer systems that work to help dissipate heat generated by automotive, medical, electronics, and industrial applications. These heat sinks provide cooling for processors, power transistors, power supplies, and supply regulators. The 821502B00000 contains a large radiative aluminum or copper heat sink with fins that rapidly disperse the heat that is generated while the computer is in operation.

The 821502B00000 heat sink consists of a base plate and multiple fins, which are typically arranged in an aluminum or copper material structure. The base plate helps to ensure that all the components of the heat sink are held firmly in place. The fins then act as heat dissipators, allowing the heat generated by the computer to be quickly released. This also makes it easier to maintain the internal temperature of the computer.

In order for the 821502B00000 to work effectively, the thermal resistance must be kept to a minimum. This is accomplished by the placement of a thermally conductive material between the base plate and the fins, as well as the use of a thermal pad or gap filler between the fins. The use of thermally conductive materials also helps to reduce the amount of heat that is allowed to accumulate in the fin area.

In order to reduce the amount of space needed for the 821502B00000, the fins are generally arranged perpendicularly so that the fin tips are in contact with each other. This allows for a larger surface area, which helps to increase the efficiency of the heat dissipation process. The fins can also be arranged in a staggered pattern to help to reduce hotspots.

Another important aspect of the 821502B00000 heat sinks is the fan, which helps to move the air around the fins and answer room temp much faster. This helps to reduce the heat buildup in the fin area, as well as the overall temperature of the computer. The fan can also be used to control the speed of the heat sink, allowing for more efficient cooling.

Finally, the 821502B00000 includes several features, such as heat sink ventilation that can be adjusted according to the specific requirements of the application. It also includes a built-in temperature sensor that helps to monitor the internal temperatures of the system. The 821502B00000 can also be used to supplement existing cooling systems, such as water cooling.

Overall, the 821502B00000 is a useful component for any computer system that needs to manage heat effectively. It works to disperse the heat quickly and efficiently, providing increased cooling efficiency and improved system performance. The addition of a fan and thermal resistance help to reduce the overall temperature of the system, making it much more efficient and reliable.

The specific data is subject to PDF, and the above content is for reference

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