84530-002LF

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84530-002LF is a rectangular connector specifically designed for mezzanine (board-to-board) applications. Its design features two rows of contacts with pitches of 0.079 in (2.00 mm) and a stack height of 0.219 in (5.56 mm). This configuration provides a higher density solution compared to similar connectors with traditional 0.100 in pin-pitch designs. The product is designed to allow for the addition of multiple layover parts, which can help increase density even further.

The 84530-002LF connectors also provide the user with multiple options for designing their board layout. This is due to the ability to populate contacts in the connector corner, as well as on the inside of each band. This makes it possible for superior stacking configurations and further increases the connector\'s PCB real estate savings.

The 84530-002LF is equipped with an array of two rows of contacts on 0.100" centers, with a simplified board interconnect option (no additional slide-in middle part) making it ideal for superior stack density. The connectors are surface mountable and rated for a current carrying capacity of 3.5A and have a maximum operating voltage of 50 V AC or DC. The insulation resistance is 500 MΩ (minimum).

The 84530-002LF connectors feature a contact retention force that is 10 lbs (min) and a contact retention force of 12 lbs (min) to provide stable electrical contact. Additionally, the product is UL rated for use in order to meet stringent safety requirements. It is RoHS compliant and available in lead-free versions.

When it comes to the working principle of 84530-002LF, it relies on a dual beam system combined with dual beam contacts. The dual beam system allows for a wider range of contact forces and improved mechanical stability. The dual beam contacts feature a unique shape that ensures maximum contact force for reliable electrical signal noise suppressions. Furthermore, the dual beam contacts have a wide contact surface area providing superior electrical connection.

The 84530-002LF is designed for use in a wide variety of applications. It can be utilized in consumer electronics, networking, telecommunications, medical equipment, industrial automation and more. It provides users with a reliable and efficient solution for designs that require a higher level of signal integrity. Its small form factor, high current carrying capacity and increased density make it a great choice for tight board-to-board connections.

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