84530-202LF

Series:	MEG-Array®, MezzSelect™
Packaging:	Bulk
Part Status:	Active
Connector Type:	Array, Male Pins
Number of Positions:	200
Pitch:	0.050" (1.27mm)
Number of Rows:	10
Mounting Type:	Surface Mount
Features:	--
Contact Finish:	Gold or Gold, GXT™
Contact Finish Thickness:	50.0µin (1.27µm)
Mated Stacking Heights:	10mm, 12mm, 14mm
Height Above Board:	0.368" (9.35mm)

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Introduction

The 84530-202LF is an array type of edge connector, designed for mezzanine board-to-board applications. It is a two-row, 56-position, low-profile connector system that provides an efficient and durable interconnecting solution. It is compliant to ESA5104E version 5 dimensional requirements.

Features

The 84530-202LF adheres to the EIAJ/ICM standard SSG11 and features with high reliability and superior machined contacts. It offers a wide range of high-temperature tin- and gold-plated contact finishes, and is ideal for mass storage, communication, and board-to-board applications. Many of its features and advantages include:

• Finger control, secure latching
• Low-profile design saves valuable board space
• Smooth, fast board-to-board mating
• Dual row option for increased density
• Choice of high-temperature tin or gold plating for superior durability and longevity
• Flexible cable routing options available
• Robust 12A current-carrying capability

Application

The 84530-202LF is suitable for both serial and parallel applications, making them ideal for a variety of mezzanine board-to-board applications. Some of the most common applications include compact routers, high-end servers, aircraft control systems, switches, and networking systems.

Working Principle

The 84530-202LF features with finger control and secure latching features, which provide a reliable interconnect system. The contacts are plated with either high-temperature tin or gold plating for superior durability and longevity. The contact system is designed to provide a smooth and fast board to board mating process. It offers dual row option for increased density.To start the connection process, the connection is engaged by pushing the board to the header in a vertical movement until it is securely seated. The interlocking latch ensures that the board remains firmly attached to the header. The latch ensures durability and enables a secure board-to-board connection. Upon removal, the latch must be depressed to free the boards from the header and allow the board to be removed.

Conclusion

The 84530-202LF connector is an ideal solution for many mezzanine board-to-board applications. It is designed with finger control, secure latching, and low profile design to achieve high density and reliable board-to-board connections. The choice of high-temperature tin or gold plating for superior durability and longevity ensures that the connection lasts for years. In addition, it is compliant with ESA5104E standard and accepts up to 12A current. Therefore, it is perfect for high-end servers, switches, networking systems, and communication applications.

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