A3P250-FGG144I Integrated Circuits (ICs)

Series:	ProASIC3
Part Status:	Active
Lead Free Status / RoHS Status:	--
Total RAM Bits:	36864
Moisture Sensitivity Level (MSL):	--
Number of I/O:	97
Number of Gates:	250000
Voltage - Supply:	1.425 V ~ 1.575 V
Mounting Type:	Surface Mount
Operating Temperature:	-40°C ~ 100°C (TJ)
Package / Case:	144-LBGA
Supplier Device Package:	144-FPBGA (13x13)
Base Part Number:	A3P250

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Embedded - FPGAs (Field Programmable Gate Array)

A Field Programmable Gate Array (FPGA) is an integrated circuit, or IC, that enables the rapid (or "field" programming of specific applications. This makes it an invaluable tool for many organizations who have to rapidly develop specialized hardware while avoiding extensive development costs. The A3P250-FGG144I is a type of FPGA from Advanced Micro Devices, Inc. (AMD), designed to enable designers to quickly and easily customize system hardware for a wide range of embedded applications.The A3P250-FGG144I is a single-chip FPGA with a capacity of up to 192 I/O pins. It has a variable latency and can process up to 3.3 billion operations per second. As a single-chip FPGA, it combines the benefits of traditional FPGAs and ASICs, allowing it to accommodate lower power and voltage requirements. As a result, the A3P250-FGG144I can reduce power consumption while still delivering higher performance.The A3P250-FGG144I is ideal for embedded applications requiring high scalability and flexibility. Its configurable logic blocks (CLBs) can be reconfigured quickly and easily, and its adaptive clock input ensures that only the necessary clock cycles are used for a given task. Moreover, the A3P250-FGG144I supports advanced higher-level functionalities, such as Digital Signal Processing (DSP) functions, video processing and enhanced functionality for system-on-chip (SoC) architectures.The A3P250-FGG144I offers an impressive range of features, including circuitry for evaluating critical time-related events, such as detecting and triggering events with very short time intervals. Its high-level language support also makes it ideal for quickly developing new designs or retrofitting existing ones.The A3P250-FGG144I is available in a variety of packages, with a wide range of I/O count capabilities. Its solder-down package compliments its "slap-and-go" installation capabilities, while its high-speed systems can switch programming options with minimal time consumption.The A3P250-FGG144I\'s combination of form factors, power savings, and programmability make it an ideal choice for embedded applications. With its many built-in functions, it can also reduce development time for complex applications. By utilizing the A3P250-FGG144I as part of a comprehensive system, organizations can quickly develop the hardware they need without requiring extensive engineering resources.

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