A3P250L-FGG256I Allicdata Electronics
Allicdata Part #:

A3P250L-FGG256I-ND

Manufacturer Part#:

A3P250L-FGG256I

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 157 I/O 256FBGA
More Detail: N/A
DataSheet: A3P250L-FGG256I datasheetA3P250L-FGG256I Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: ProASIC3L
Part Status: Obsolete
Total RAM Bits: 36864
Number of I/O: 157
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Base Part Number: A3P250L
Description

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Embedded – FPGAs (Field Programmable Gate Array)

Field programmable gate arrays provide a vast scope of advantages for embedded systems development. One such device is the A3P250L-FGG256I, which is a low-cost and low-power FPGA with a 256-bit configuration memory. This device offers a range of features for embedded system designs, including instant configurability and simple power management.

The A3P250L-FGG256I consists of a 32-bit processor core and 256-bit memory blocks. This allows for increased system performance and control in embedded designs. Additionally, the core supports a variety of peripheral functions such as Ethernet, CAN, and JTAG interfaces, as well as DisplayPort, USB, and SD Card interfaces.

The A3P250L-FGG256I has a wide range of applications. It can be used in many types of embedded system designs, including industrial automation, financial services, automotive systems, and remote monitoring applications. The device also can be used to build complex data processing pipelines and network control systems.

The A3P250L-FGG256I’s working principle is based on the principle of configurability. This principle allows the device to be configured in a variety of ways in order to meet the requirements of different embedded system applications. The configuration is done by programming the configuration memory of the device. The data stored in this memory will determine how the device behaves when it is powered on.

The A3P250L-FGG256I also offers a range of configurability options in terms of clock rate, power management, and IO interconnection. This allows the device to be optimized for a variety of applications, including high-speed processors and I/O devices and for applications with low-power requirements.

The A3P250L-FGG256I features a fast boot-up time and quick reconfiguration which make it an ideal choice for applications that need to be reconfigured often. The device is also able to be reconfigured while the system is running, providing flexibility and versatility.

In addition to the configurability options, the A3P250L-FGG256I offers several design benefits, such as high levels of integration, a wide operating temperature range, and a low power dissipation rate. These features make the device suitable for a variety of applications.

In conclusion, the A3P250L-FGG256I is an ideal choice for embedded system designs. It offers a range of features and configurability options which make it suitable for a variety of applications. The device’s working principle is based on the principle of configurability and it is capable of high levels of integration and low power dissipation rates. These features make the device an ideal choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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