A3PE1500-2FGG676I Allicdata Electronics
Allicdata Part #:

A3PE1500-2FGG676I-ND

Manufacturer Part#:

A3PE1500-2FGG676I

Price: $ 142.35
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 444 I/O 676FBGA
More Detail: N/A
DataSheet: A3PE1500-2FGG676I datasheetA3PE1500-2FGG676I Datasheet/PDF
Quantity: 1000
40 +: $ 129.41400
Stock 1000Can Ship Immediately
$ 142.35
Specifications
Series: ProASIC3E
Part Status: Active
Total RAM Bits: 276480
Number of I/O: 444
Number of Gates: 1500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
Base Part Number: A3PE1500
Description

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Embedded FPGAs (Field Programmable Gate Array) offer an effective means to develop devices that require increased flexibility and fast-changing capability. A3PE1500-2FGG676I is a FPGA application that is becoming increasingly popular because of its features and advantages. This article will provide an overview of the A3PE1500-2FGG676I application field and working principle.

The A3PE1500-2FGG676I is a field programmable gate array with an integrated single-chip implementation. This integrated implementation enables designers to take advantage of the large number of internal logic elements that can be used to build an extremely powerful and flexible embedded system. The Gate Array includes a range of pre-defined hardware functions, such as DSP algorithms and interfaces. The FPGA also supports applications such as communications and communication buses, artificial intelligence (AI) systems, network security, and RF radio systems. It is well suited for applications requiring high performance and rapid response time.

The A3PE1500-2FGG676I offers a suite of tools that is designed to make product development fast and easy. It offers a Graphical Development Environment (GDE) which is used to create, debug and modify designs. The GDE also allows designers to develop and deploy applications quickly and easily without the need to invest in expensive design tools. The toolset also provides a range of dedicated design blocks and pre-defined IP cores for rapid development. Additionally, the A3PE1500-2FGG676I includes resources for applications such as memory control, microcontrollers, and system-on-chip integration.

The A3PE1500-2FGG676I features a high-performance, low-power architecture. It also contains a range of embedded memory blocks with both on-chip and external device memory blocks. The device is designed with two-level power management in order to reduce power consumption while ensuring a fast response time. Additionally, the device features high-speed communications between embedded IPs and system components. The FPGA is designed to support multiple programming techniques, allowing designers to use their existing development tools and techniques in order to create custom applications.

The A3PE1500-2FGG676I is capable of supporting a range of peripherals and interfaces, including USB 2.0, Ethernet, and wireless connectivity. The device is also designed with multiple power supply options and can be used with standard 3V, 5V, and 12V DC power supplies. The device also supports a wide range of military and industrial interfaces, such as MIL-STD-1553B and CAN, as well as high-speed serial protocols. Additionally, the device integrates the Atheros Wireless Interface. This allows designers to incorporate wireless networking into their applications.

The A3PE1500-2FGG676I feature set enables designers to quickly and easily implement applications that require a high degree of flexibility, high speed, and low power consumption. The device also features high-performance peripherals, such as Ethernet and USB, as well as wireless and military interface support. Additionally, the device features a range of dedicated design blocks, allowing designers to rapidly create products with features and capabilities that are tailored to their specific product requirements. Finally, the device is designed with two-level power management, allowing designers to lower power consumption while maintaining performance and product reliability.

The specific data is subject to PDF, and the above content is for reference

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