APF19-19-06CB

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A thermal-heat sink is a device, component, or assembly designed to efficiently transfer and dissipate heat away from its source. Thermal-heat sinks are commonly integrated into consumer electronics such as computers, cameras, and mobile devices. The primary purpose of a thermal-heat sink is to dissipate heat away from its source, allowing electronic components to stay within optimal temperature conditions for proper operation and extended lifespan. The APF19-19-06CB is an example of a heat sink designed for the application field of consumer electronics.

The APF19-19-06CB thermal-heat sink is a flat-pack device consisting of an aluminum alloy finned housing, supported by a stamped steel frame with silicone gaskets. It is a free air-flow thermal-heat sink, meaning it does not require any external air or liquid to efficiently absorb and dissipate heat. Its finned design enables better heat disbursement and effective cooling. The APF19-19-06CB measures 68mm by 53mm by 20mm, and has a heat dissipation power of 15 watts.

The APF19-19-06CB thermal-heat sink harnesses convection-based heat transfer for efficient thermal-management. The device hosts a finned coil in its interior which is responsible for absorbing ambient heat emanating from the electronic components it is attached to. Since the device carries an integrated heat source, it also capitalizes on conduction as a therm-management strategy. This is achieved through the heat source’s direct contact with the base plate frame and its thermally conductive silicone gaskets.

Aside from its core strategies of convection and conduction, the APF19-19-06CB thermal-heat sink also capitalizes on natural air flow to aid heat transfer. Natural air flow from the vents at the top of the device creates a convection loop which carries the heat from its source, over the finned coil, and away from the device. The APF19-19-06CB can maintain an efficient heat transfer rate of up to 4W/K at room temperature.

In order to carbon offset environmental impact, the APF19-19-06CB thermal-heat sink has gone through an in-depth environmental assessment. This includes an evaluation of the energy consumption and its emission level. The assessments show that the APF19-19-06CB thermal-heat sink requires only 6-10 watts to operate, and has an emission level of 0.43-1.39 g/kWh. It is also worth noting that the thermal-heat sink uses 95% recyclable aluminum alloy.

The APF19-19-06CB is equipped with integrated security features such as overload prevention and anti-burn capability. Upon reaching critical temperatures, the thermal-heat sink will automatically stop any potentially damaging thermal transfer processes, then initiate a cooldown process. This automatic shutdown and cooldown safeguards the electronic components it is attached to from any possible overheating, burning, or other component damage.

In conclusion, the APF19-19-06CB is a thermal-heat sink designed for the application of consumer electronics. This device is an efficient heat source and cooling solution, and combines the principles of convection, conduction, and air flow to efficiently disseminate heat. The APF19-19-06CB requires low energy consumption and has an environmentally friendly emission rating as well as integrated safety features. The device measures 68mm by 53mm by 20mm and has a heat dissipation power of 15 watts.

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