APF19-19-13CB

Series:	APF
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square, Fins
Length:	0.748" (19.00mm)
Width:	0.748" (19.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Thermal - Heat Sinks are devices used to dissipate heat from components such as processors, memory, or any electronic device that generates heat. This is necessary for them to function properly. Without the cooling provided by these devices, electronics components would become too hot and would eventually fail. Heat sinks are often passive, meaning they rely on convection and/or conduction to transfer the heat away from the component.

APF19-19-13CB Application Field and Working Principle

The APF19-19-13CB Heat Sink is a thermally-advantaged low-profile design which provides both conduction and convection cooling. The conduction cooling is achieved through direct contact between the heat sink and the electronic component, while the convection cooling is achieved by circulating air over the heat sink. The APF19-19-13CB Heat Sink is commonly used in computing and telecommunications, as well as application-specific designs, and is suitable for both air-cooled and water-cooled applications. The APF19-19-13CB Heat Sink is composed of a base made of aluminum and a fin stack made of aluminum or copper. The fin stack is made up of multiple, thin metallic fins that are arranged in a manner which allows optimal heat transfer from the base of the heat sink to the fins. The fins are also designed to increase the air flow for enhanced convection cooling.The design of the APF19-19-13CB Heat Sink also features a unique optimized fin geometry which further enhances heat transfer. By shaping and arranging the fins in a specific manner, the heat sink creates a larger surface area for air circulation, resulting in increased heat dissipation. The APF19-19-13CB Heat Sink also features two mounting options. The first option is a surface-mounting bracket which allows for quick and easy installation. The second option is a screw-mounting bracket, which requires the use of screws and nuts for installation. This allows for a secure fit between the heat sink and the electronic component.

Conclusion

The APF19-19-13CB Heat Sink is an effective solution for dissipating excessive heat from components. The combination of conduction and convection cooling, along with the optimized fin geometry, ensures that the heat sink is able to efficiently transfer heat away from the component and prevent it from reaching unsafe levels. In addition, the two mounting options enable the APF19-19-13CB Heat Sink to be easily and securely installed without the need for additional tools or materials. All these features make the APF19-19-13CB Heat Sink a reliable and cost-efficient cooling solution for all kinds of electronic components.

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