Allicdata Part #: | 294-1148-ND |
Manufacturer Part#: |
APF19-19-10CB/A01 |
Price: | $ 4.66 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED W/ADHESIVE TAPE |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APF19-19-10CB/A01 Datasheet/PDF |
Quantity: | 876 |
1 +: | $ 4.23990 |
10 +: | $ 4.12335 |
25 +: | $ 3.89466 |
50 +: | $ 3.66547 |
100 +: | $ 3.43634 |
250 +: | $ 3.20728 |
500 +: | $ 2.97817 |
1000 +: | $ 2.92090 |
Series: | APF |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 0.748" (19.00mm) |
Width: | 0.748" (19.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.370" (9.40mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are among the most common ways of dissipating energy from a device or component. The APF19-19-10CB/A01 heat sink is a fan-based, forced-air solution that is designed to maximize air flow over the surface area of the components using heat pipes to dissipate heat. The forced-air heat sinks are capable of cooling components to higher temperatures than those typically achievable with passive heatsinks.This type of heat sink can provide efficient cooling in high ambient temperature environment for fine point cooling or a larger enclosure to cool larger components. In the larger enclosure, components designed to reduce thermal resistance with near infinity cooling are possible.
The main components of the APF19-19-10CB/A01 heat sink are the fan, heat pipes, and fins. The fan draws air into the heat sink, and the air is then passed over the heat pipes. The heat pipes are specifically designed to absorb heat from the component and dissipate it into the fins. The fins are made from a material that can easily and rapidly conduct heat away from the heat pipes. The fins are further designed to increase the surface area of the heat sink so that more heat can be dissipated.
The fan configuration used by the APF19-19-10CB/A01 heat sink is known as an active-cooling solution. Active-cooling solutions are used when the airflow is necessary to dissipate the heat from the components. The fan is powered by the fan manufacturer and is capable of achieving very high airflow rates. The fan provides the most efficient cooling when the ambient temperature is very high. Cooling performance will decline as ambient temperature declines.
The heat pipes used by the APF19-19-10CB/A01 heat sink are specifically designed to absorb heat from the component and dissipate it into the fins. The heat pipes are made from a high-thermally conductive material and are designed to maximize heat transfer from the component to the fins. The heat pipes also have a low thermal resistance so that the heat can be transferred quickly and easily. The heat pipes are typically made of a copper or aluminum material, and the design of the heat pipes is optimized to maximize the thermal performance of the heat sink.
The fin configuration used by the APF19-19-10CB/A01 heat sink features a combination of convection and radiation fin designs. The convection fins are designed to increase the surface area of the heat sink and allow more air to flow through the fins. The radiation fins are designed to radiate the heat directly from the heat pipes to the surrounding environment. The fins are also designed to maximize the heat transfer from the heat pipes to the fins.
The APF19-19-10CB/A01 heat sink is a forced-air solution that is capable of providing efficient cooling for a variety of applications. The main components of the heat sink allow for efficient heat dissipation, and the fan helps to ensure that the components remain cool even in high ambient temperatures. The heat pipes and fins are both designed to maximize the thermal performance of the heat sink so that components can be cooled effectively.
The specific data is subject to PDF, and the above content is for reference
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