FP50R12KS4CBOSA1 Allicdata Electronics
Allicdata Part #:

FP50R12KS4CBOSA1-ND

Manufacturer Part#:

FP50R12KS4CBOSA1

Price: $ 103.61
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: IGBT MODULE VCES 600V 50A
More Detail: IGBT Module Single 1200V 70A 360W Chassis Mount M...
DataSheet: FP50R12KS4CBOSA1 datasheetFP50R12KS4CBOSA1 Datasheet/PDF
Quantity: 1000
10 +: $ 94.18570
Stock 1000Can Ship Immediately
$ 103.61
Specifications
Series: --
Part Status: Active
IGBT Type: --
Configuration: Single
Voltage - Collector Emitter Breakdown (Max): 1200V
Current - Collector (Ic) (Max): 70A
Power - Max: 360W
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
Current - Collector Cutoff (Max): 5mA
Input Capacitance (Cies) @ Vce: 3.3nF @ 25V
Input: Standard
NTC Thermistor: Yes
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: Module
Supplier Device Package: Module
Description

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The FP50R12KS4CBOSA1 is a state-of-the-art energy efficient Insulated Gate Bipolar Transistor (IGBT) module that is capable of providing highly efficient power conversion performance for a wide range of applications. The IGBT module uses a 3-phase bridge arrangement and is capable of power switching up to 1250Volt. The module offers applications for AC motor drives, HVAC compressor drives, solar inverters, railway traction propulsion systems, power factor correction and more.
The FP50R12KS4CBOSA1 module is based on the latest advancements in power semiconductor technology. It is designed with a hybrid planar structure and low-inductance bus bars which enables this device to deliver extremely efficient switching performance as compared to other IGBT modules available in the market. The device is capable of operating with a wide range of temperatures and has been tested to meet the stringent requirements of power semiconductor manufacturers. Along with high power efficiency, the device also offers low EMI emissions, making it ideal for use in residential and industrial environments.
The device uses a multi-junction structure which helps reduce the overall power dissipation of the module. This structure is made up of a base wafer with a silicon dioxide film that is connected to the metal gate. The metal gate then connects to the silicon dioxide film and the metal contact plate and metal frame. This multi-junction structure also helps reduce the thermal runaway of the IGBT module. Additionally, the device has a built-in temperature sensing terminal which monitors the module temperature, helping to protect the module from any sign of over-temperature conditions.
In terms of working principle, the FP50R12KS4CBOSA1 IGBT module works on the principle of electron emission. The module consists of a gate electrode and an insulated gate that can control the flow of electric current. The gate electrode acts as a switch to turn on and off the electron flow, and when the electric current is turned on, the electrons fly from the base to the collector. The collector then supplies the current to the external circuit. The intensity of electric current that passes through the device depends on the voltage between the collector and the gate electrodes.
The FP50R12KS4CBOSA1 IGBT module is a highly versatile device and is applicable to a wide range of applications. Its versatile range of features makes it capable of delivering efficient switching performance in applications such as AC motor drives, HVAC compressor drives, solar inverters, railway traction propulsion systems, power factor correction and more. Moreover, its advanced multi-junction structure helps reduce the overall power dissipation of the module, and its built-in temperature sensing terminal helps protect the device from over-temperature conditions, making it a

The specific data is subject to PDF, and the above content is for reference

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