GD25LD80CTIGR

Series:	--
Packaging:	Tape & Reel (TR)
Part Status:	Active
Memory Type:	Non-Volatile
Memory Format:	FLASH
Technology:	FLASH - NOR
Memory Size:	8Mb (1M x 8)
Clock Frequency:	50MHz
Write Cycle Time - Word, Page:	60µs, 6ms
Memory Interface:	SPI - Dual I/O
Voltage - Supply:	1.65 V ~ 2 V
Operating Temperature:	-40°C ~ 85°C (TA)
Mounting Type:	Surface Mount
Package / Case:	8-SOIC (0.154", 3.90mm Width)
Supplier Device Package:	8-SOP

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GD25LD80CTIGR Memory

The GD25LD80CTIGR is a memory solution with many applications in a wide range of disciplines, including communications, computing, control, instrumentation, and storage applications. It is an integrated 8-pin dual-inline package (DIP) memory device with a total capacity of 32 Mbit.The GD25LD80CTIGR has the following features:

• High-speed operation: 70 ns cycle time
• Low power consumption: 2 mA load, 14 mA maximum
• Fast data access: 4-bit wide command/address bus
• Simple programming interface: 8-bit and 16-bit instructions

The GD25LD80CTIGR is a non-volatile memory device that implements a Static RAM (SRAM) structure. It offers a high-performance and cost-effective solution for data storage and retrieval. It utilizes an 8-bit, multiplexed command/address bus, which allows fast and reliable access to data stored in the device.The memory architecture of GD25LD80CTIGR is similar to that of conventional SRAMs. It consists of four separate 32K x 8 memory blocks, each with its own unique 8-bit address comprising the command/address bus. Each block can hold 16K of data. The multiplexed address lines enable staggered operations of the memory blocks, further speeding up access times.The GD25LD80CTIGR has several key benefits over conventional SRAMs. These include higher performance, lower power consumption, and significantly lower cost. The multiplexed address bus also reducesarea requirements and makes the device ideal for applications that require high-density memory components.The GD25LD80CTIGR is well suited for a wide range of applications, including automotive and industrial automation, communications, data acquisition, embedded system, internet of things (IoT), medical, security, and telecommunication. It is equipped with an extended temperature range operation, making it an ideal choice for use in harsh environmental conditions.The GD25LD80CTIGR is also available in several package configurations, including the 8-pin DIP and 8-pin SOIC packages. The device is capable of operating at temperature ranges from -40°C to 85°C. It can be programmed and erased in the field, making it suitable for use in applications where programming and/or reprogramming are necessary.In summary, the GD25LD80CTIGR is a reliable, high-performance, and cost-effective memory solution. It offers a wide range of features and benefits and is suitable for use in a variety of applications. With its extended temperature range and simple programming interface, the GD25LD80CTIGR is a practical and cost-effective choice for many memory solutions.

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