MAX5903LBEUT+T

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PMIC - Hot Swap Controllers are used to provide a safe, reliable and efficient method of connecting and disconnecting a system component or circuit module with minimal impact to the power supply and system operations. To fulfill the said task, MAX5903LBEUT+T application field and working principle can provide the necessary solution.

MAX5903LBEUT+T is an N-Channel MOSFET Hot Swap Controller from Maxim Integrated specifically designed to control an N-Channel MOSFET and protect a system component when hot swapping on a live-powered system. It features an ideal diode current-sensing architecture that eliminates power losses from the MOSFET body-diode conduction when used with N-channel MOSFETs. This architecture also provides fast response times to on-off control, over-temperature events, current limit, and undervoltage lockout.

The MAX5903LBEUT+T hot-swap controller has an adjustable current threshold that ranges up to 25A. The device provides a low-power sleep mode and an externally controlled latch-off mode to disable the external MOSFET. An integrated charge pump is used to generate the gate drive voltage required to turn on the external MOSFET. The device contains an undervoltage lockout (UVLO) circuit that trips when the supply voltage drops below an internally set level.

In terms of working principle, the device uses its charge pump voltage to drive a logic-level n-channel giant MOSFET as the external switch to apply and disconnect power to the system component. The charge pump voltage is applied for at least 1ms before a logic level is applied to the gate of the external MOSFET, to prevent the external MOSFET from being partially turned on due to the relay chatter. The device detects a load current passing through a 0.33Ω sense resistor by comparing the voltage drop across the external MOSFET\'s body diode to an internally adjusted current threshold level.

For systems where an N-channel MOSFET is used for over-temperature protection, MAX5903LBEUT+T has a thermal foldback feature that reduces the load current as the die temperature of the IC increases. This Foldback sensing is enabled by connecting an external NTC thermistor between the VTB and TEMP pins. When the temperature of the NTC thermistor mounts to a predefined level, the load current is reduced to the foldback current (I_FOLD) limit.

The device also comes with an Overtemperature Shutdown (OTS) feature that Shuts down the external MOSFET immediately when the overtemperature input voltage on the TEMP pin exceeds an internally set trip point. The OTS feature does not reset until the die temperature is below the internal OTS trip point and the TEMP pin voltage is below the reset threshold value.

In order to protect the system from inrush current events, the MAX5903LBEUT+T hot-swap controller features an inrush current limit that is configurable with an external resistor. When the load current is above the Inrush current limit, the controller delays the rise of the output voltage. The delay time is proportional to the amount the load current exceeds the limit.

MAX5903LBEUT+T application field and working principle can therefore provide solutions to a wide range of applications such as processor and microcontroller, system memory and storage, peripheral cards, as well as any other application that require a safe, reliable and efficient Hot Swap technology to connect and disconnect a system component or circuit module with minimal impact to the power supply and system operations.

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