MAX5955BEEE+

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The MAX5955BEEE+ integrated, high-side, hot-swap power IC is a critical component in general-purpose, high-reliability, and higher-power applications, such as server systems and telecommunications equipment. It is designed to provide power solutions for applications requiring very high efficiency, inrush current protection, adjustable current/voltage limits for controlled powering/insertion of boards, output overvoltage protection, adjustable voltage sequencing, and overtemperature protection.

Hot swap controllers are essential for safely integrating board-level components in systems that operate under high power and/or high temperature conditions. MAX5955BEEE+ hot swap controllers, by safely providing power to boards while they are being inserted, removed, and upgraded, play a paramount role in maintaining a reliable, fault-tolerant system.

Overview of MAX5955BEEE+

The MAX5955BEEE+ is an integrated hot-swap controller that combines the functions of a power MOSFET, current-limit comparator, thermal shutdown, and temperature sensor into a single device. This family of devices supports two modes of power delivery – dynamic voltage ramping and autonomous voltage ramping. The device is designed to switch inductive loads up to 30A.

The MAX5955BEEE+ offers improved efficiency for hot-swap applications by combining on-chip devices, resulting in reduced design complexity and improved safety. The hot swap controller combines the features of a high-side MOSFET and current limit comparator, thermal and overvoltage protection, and adjustable voltage sequencing into a single device. The hot swap controller reduces board-level component count while delivering the highest performance available in an integrated hot swap controller.

The MAX5955BEEE+’s programmable features include a Fault Comparator with adjustable current trip or fast-trip point, current foldback, adjustable current limit and soft-start, adjustable voltage rising and/or falling time, and adjustable voltage overshoot and undershoot. All of these features are designed to ensure a safe, fault-tolerant system with excellent board-level performance.

Applications

As an integrated hot-swap controller device, the MAX5955BEEE+ is ideal for a variety of applications, such as powering backplanes, disk drive and solid-state drive (SSD) enclosures, motherboard processing circuitry, server systems, and multi-PCI slots. It is designed to provide power protection and delivery for applications requiring very high efficiency, inrush current protection, adjustable current/voltage limits for controlled powering/insertion of boards, output overvoltage protection, adjustable voltage sequencing, and overtemperature protection.

The MAX5955BEEE+ is also ideal for industrial, communication, and entertainment applications, such as multiple theater systems, cable TV signal processors, and mixer consoles, as well as automotive applications, such as power distribution and power management systems.

Working Principle

The MAX5955BEEE+ is an integrated device that combines high-side MOSFET switching, current-limit comparator, thermal and overcurrent protection, and adjustable voltage sequencing. These features, along with its high efficiency and wide operating temperature range, make the MAX5955BEEE+ ideal for a variety of applications.

When the device is connected to the input voltage (VIN), it begins its power-on sequence. During the power-on sequence, the device monitors the output voltage (VOUT), and shut down if the voltage gets too high. If the voltage does not exceed the maximum allowable threshold, the device will enable the MOSFET and allow for controlled powering/insertion of the board.

Once the board is safely inserted and powered, the current limit comparator monitors the current flowing through the MOSFET. The comparator will trip if the current exceeds the set point and the MOSFET is disabled, thus preventing damage to the board and system components. Additionally, the device includes a fast-trip comparator that will activate if the MOSFET is subjected to a current spike.

The device also includes thermal protection to ensure the MOSFET does not overheat, and an adjustable voltage ramping circuit to allow for controlled powering/insertion of the board. The MAX5955BEEE+ also supports optional adjustable voltage sequencing and output overvoltage protection.

Conclusion

The MAX5955BEEE+ integrated, high-side, hot-swap power IC is a critical component in general-purpose, high-reliability, and higher-power applications. As an integrated hot-swap controller device, the MAX5955BEEE+ is ideal for a variety of applications, such as powering backplanes, disk drive and SSD enclosures, motherboard processing circuitry, server systems, and multi-PCI slots. The device is designed to provide power solutions for applications requiring very high efficiency, inrush current protection, adjustable current/voltage limits for controlled powering/insertion of boards, output overvoltage protection, adjustable voltage sequencing, and overtemperature protection.

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