MC74AC373DWR2G Integrated Circuits (ICs)

The MC74AC373DWR2G is a 3-state octal flip-flop with three-state output from Texas Instruments (TI), an integrated circuit manufacturer. This chip is a kind of logic- latch with very low-power operation and good electromagnetic compatibility (EMC) performance. Its primary application areas include data storage and transfer in telecommunications networks, datacom bus applications, and peripheral interface applications.

The MC74AC373DWR2G has two separate pins for each function, plus two common pins – Vcc and GND. The MC74AC373DWR2G has two separate inputs – one to control the latch and another to control the output.

The latch-enable or LE pin is used to control the latch state. When LE is pulled low, the latch is reset and the outputs are in a high-impedance state. When LE is high, the data is latched and the output is active.

The output enable or OE pin is used to control the output state. When OE is pulled low, the output is in a high-impedance state. When OE is high, data flows from the inputs and can be observed on the outputs.

The MC74AC373DWR2G also has two additional inputs – Clock and Clock Enable – which determine how the data is latched. When Clock Enable is low, the Clock pin is ignored and data is latched on the rising edge of LE; and when Clock Enable is high, data is latched on the rising edge of Clock and LE.

The core of the MC74AC373DWR2G is composed of a set of flip-flops and buffers. The flip-flops latch the data when the enable lines are asserted. The buffers drive the outputs when the outputs are enabled. The data is clocked through the output enable line so that the data appears at the outputs as soon as the output enable is asserted.

The MC74AC373DWR2G is designed for a wide range of working voltage from 1.65V to 5.5V and has very low propagation delays, making it ideal for use in high-speed applications. Its maximum power dissipation is 750mW, allowing it to be used in both high-power and low-power applications. Moreover, the chip is designed with a current capability of up to 12mA, enabling it to drive heavy loads.

In conclusion, the MC74AC373DWR2G from TI is an ideal solution for data storage and transfer tasks in telecommunications networks and various peripheral interface applications which require low-power operation and good electromagnetic compatibility.