MHSL10055

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The MHSL10055 is a thermal heat sink, designed to disperse heat from computer components to improve their performance. It is constructed of a high-strength aluminum alloy, providing excellent thermal transfer properties and long life.

The MHSL10055 is made of a two-piece design, consisting of an outer casing and an inner core. The core is constructed of a copper clad aluminum alloy, while the outer casing is made of die-cast aluminum. This two-piece engineering design provides improved heat dissipation, while at the same time providing a lightweight, space-saving design.

The MHSL10055 is designed for gravity-fed, non-forced air cooling devices like CPU fans, case fans, and power supplies. It can be mounted to any standard chassis as well as to a flat surface. The mounting holes are designed for compatibility with standard computer component mounts.

The MHSL10055 has an extended surface area to improve the amount of heat it can dissipate. It is designed with a finned aluminum alloy base which increases the surface area and increases the overall thermal transfer efficiency. The fins also help direct the heat away from sensitive areas of the component, such as the printed circuit board or the electronic components.

The MHSL10055 is designed to be used in a wide variety of applications. It can be used in cooling residential and commercial electronics, including computers, monitors, printers, and many other electronic devices. It can also be used in audio/video equipment, medical devices, telecommunications devices, military equipment, and other applications where thermal management is necessary.

The MHSL10055 is designed to work in a passive, gravity-based environment. The heat sink is designed to take advantage of natural convection to dissipate heat. The aluminum alloy core and fins act as heat sinks, transferring the heat away from the component and dissipating it through the fins, improving cooling efficiency.

The MHSL10055 is a great thermal heat sink for a variety of applications. Its design offers improved thermal transfer properties and its lightweight design allows it to be easily mounted to many different surfaces. The extended heat dissipation area and its direct contact design make it an ideal choice for cooling a variety of different applications.

The specific data is subject to PDF, and the above content is for reference