| Allicdata Part #: | MHSL15055-ND |
| Manufacturer Part#: |
MHSL15055 |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | GE Critical Power |
| Short Description: | HEATSINK 4.56L X1.4"H EXTRUSION |
| More Detail: | Heat Sink Aluminum Board Level |
| DataSheet: |  MHSL15055 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | -- |
| Part Status: | Obsolete |
| Type: | Board Level |
| Package Cooled: | -- |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 4.560" (115.82mm) |
| Width: | 2.360" (59.94mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.400" (35.56mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks: MHSL15055 Application Field and Working Principle
MHSL 15055 is an advanced compact heat sink from Marvell High Speed Semiconductor Technologies. It is a particularly high profile heat sink with an optimized thermal management solution which includes a wide range of proprietary technologies and a comprehensive portfolio of thermally optimized advanced thermal solutions. It is designed to provide optimal performance in any temperature environment.
This advanced component is suitable for general-purpose use in microelectronic and semiconductor applications and is well-suited for various high-power operations.The high profile thermal design of MHSL 15055, combined with its optimized thermal properties, make it ideal for applications where high thermal efficiency is required. The specialized heat exchanger also helps to dissipate heat effectively to achieve the highest possible thermal performance.
Application Field of MHSL 15055
The MHSL 15055 heat sink is ideal for any application that requires the highest thermal performance. It is suitable for microelectronics and semiconductor applications including:
- High-power processors such as CPUs
- Advanced GPUs
- High-speed memory modules
- High-end graphics cards, servers, and routers
- High-performance networking systems
- High-end, high-power FPGAs
Working Principle of MHSL 15055
The MHSL 15055 heat sink is designed with a specialized heat exchanger to facilitate efficient heat transfer. The heat exchanger utilizes a set of thermally conductive material layers which sandwich between a central lattice-like thermal interface material. This helps to minimize thermal resistances while maximising the heat transfer rate. In addition, the heat exchanger also features a series of fins which act as an extended surface area for dissipating heat more effectively. The fins increase the surface area of the heat exchanger and can also be used for different profiles depending on the application. The unique thermal design of the heat exchanger and optimized thermal properties of the MHSL 15055 heat sink make it ideal for high-power operations. The advanced component has been designed to not only dissipate heat more effectively but also to minimize mechanical stress on the components—a critical feature for many high-power applications. The MHSL 15055 is an advanced thermal solution that is suitable for any application which requires the highest thermal performance. It is designed for easy integration, offering high reliability and superior performance. It is an optimal solution for applications where high-efficiency cooling is essential.
The specific data is subject to PDF, and the above content is for reference
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