Allicdata Part #: | MHSL15040-ND |
Manufacturer Part#: |
MHSL15040 |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | GE Critical Power |
Short Description: | HEATSINK 2.30L X1.4"H EXTRUSION |
More Detail: | Heat Sink Aluminum Board Level |
DataSheet: | MHSL15040 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | -- |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 2.390" (60.71mm) |
Width: | 2.280" (57.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.400" (35.56mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks are essential parts of electronics as well as other applications that need to dissipate excess heat in order to maintain optimal performance. MHSL15040 is a type of thermal - heat sink that is designed for this exact purpose, and it operates through a simple yet effective working principle. This article will explain the application field as well as the working principle of MHSL15040.
MHSL15040 is designed to be an effective thermal - heat sink for applications regarding a wide range of products, such as LED, CPU, and laptop components. Its aluminum-made components have a great thermal conductivity, which allow it to effectively dissipate heat and maintain the surface temperature during the operation of the electronics. Additionally, its size is suitable for most of the applications, which significantly increases its versatility. Therefore, MHSL15040 can be an ideal choice for applications where it is necessary to dissipate heat rapidly and effectively.
The performance of MHSL15040 is highly dependent on its working principle. It utilizes a thermal conduction cooling system, which transfers the heat from the components to the surrounding air. This can be achieved through a combination of convection and radiation. The convection mechanism is the transfer of thermal energy through air or other gas molecules. When the air molecules around the thermal - heat sink come in contact with each other, they exchange kinetic energy in the form of heat. This helps to transfer the thermal energy away from the components. On the other hand, radiation is also another useful tool when it comes to thermal conductivity. Radiation is the emission of energy in the form of electromagnetic waves, which travel at the speed of light. When this electromagnetic radiation comes in contact with the surface of the thermal - heat sink, it also helps to transfer the thermal energy away.
Therefore, it can be concluded that MHSL15040 could be a suitable thermal - heat sink for a wide range of applications given its aluminum-made components with good thermal conductivity, effective convection and radiation mechanisms, and reasonable size. This makes it an ideal choice for anyone looking for a reliable and affordable thermal - heat sink for their application.
The specific data is subject to PDF, and the above content is for reference
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