MK64FN1M0VLQ12 Allicdata Electronics
Allicdata Part #:

MK64FN1M0VLQ12-ND

Manufacturer Part#:

MK64FN1M0VLQ12

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: NXP USA Inc
Short Description: IC MCU 32BIT 1MB FLASH 144LQFPARM® Cortex®-M4 Kine...
More Detail: N/A
DataSheet: MK64FN1M0VLQ12 datasheetMK64FN1M0VLQ12 Datasheet/PDF
Quantity: 4432
Stock 4432Can Ship Immediately
Specifications
Series: Kinetis K60
Packaging: Tray 
Part Status: Active
Applications: --
Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 120MHz
Controller Series: --
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Interface: CAN, Ethernet, I2C, I2S, UART
Number of I/O: 100
Program Memory Size: 1MB (1M x 8)
Voltage - Supply: 1.71V ~ 3.6V
Program Memory Type: FLASH
EEPROM Size: --
Mounting Type: Surface Mount
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 41x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)
Base Part Number: MK64FN1M0
Description

Due to market price fluctuations,if you need to purchase or consult the price.You can contact us or emial to us:   sales@allicdata.com


1. Describe

Members of the K64 product family are optimized for cost-sensitive types Applications that require low power consumption, USB/Ethernet connectivity, and Embedded SRAM up to 256 KB. These devices are shared Full support and scalability of the Kinetis series.This product provides:

1. Operating power consumption is as low as 250 μA/MHz. stationary Power consumption as low as 5.8 μA, full state retention And 5 μs wake up. Lowest static mode as low as 339 nA

2. USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO Vreg, with USB device without crystal operation

3. 10/100 Mbit/s Ethernet MAC with MII and RMII interfaces

2. Performance

    1. Up to 120 MHz ARM® Cortex®-M4 core with DSP Instruction and floating-point unit 

3. Memory and memory interface

    1. Up to 1 MB of program flash memory and 256 KB of RAM

    2. Up to 128 KB FlexNVM and 4 KB FlexRAM on the device Use FlexMemory

    3. FlexBus external bus interface

4. System peripherals

    1. Multiple low-power modes, low-leakage wake-up unit

    2. Memory protection unit with multi-master protection

    3. 16-channel DMA controller

    4. External watchdog monitor and software watchdog

5. Safety and integrity module

    1. Hardware CRC module

    2. Hardware random number generator

    3. Hardware encryption supports DES, 3DES, AES, MD5, SHA-1 and SHA-256 algorithms

    4. 128-bit unique identification (ID) number per chip

6. Analog module

    1. Two 16-bit SAR ADCs

    2. Two 12-bit DACs

    3. Three analog comparators (CMP)

    4. Voltage reference

7. Communication interfaces

    1. Ethernet controller with MII and RMII interface

    2. USB full-/low-speed On-the-Go controller

    3. Controller Area Network (CAN) module

    4. Three SPI modules

    5. Three I2C modules. Support for up to 1 Mbit/s

    6. Six UART modules

    7. Secure Digital Host Controller (SDHC)

    8. I2S module

8. Timers

    1. Two 8-channel Flex-Timers (PWM/Motor control)

    2. Two 2-channel FlexTimers (PWM/Quad decoder)

    3. IEEE 1588 timers

    4. 32-bit PITs and 16-bit low-power timers

    5. Real-time clock

    6. Programmable delay block

9. Clocks

    1. 3 to 32 MHz and 32 kHz crystal oscillator

    2. PLL, FLL, and multiple internal oscillators

    3. 48 MHz Internal Reference Clock (IRC48M)

10. Operating Characteristics

    1. Voltage range: 1.71 to 3.6 V

    2. Flash write voltage range: 1.71 to 3.6 V

    3. Temperature range (ambient): –40 to 105°C

11. Pin configuration

                           image.png


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