MT53D384M32D2DS-053 XT:C TR

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Memory is an essential component of nearly all digital systems, providing fast and lightweight storage to store program instructions and data. The MT53D384M32D2DS-053 XT:C TR is a type of memory recently released by Microtronix, with a specialized application field and working principle.

The MT53D384M32D2DS-053 XT:C TR is a Dynamic Random Access Memory (DRAM) product. It is a dual inline memory module with a capacity of 32GB of memory, and it comes in an industry standard DDR4 format. The product features 8 ranks of 4GB DDR4-2666 DDR4 SDRAM RDIMMs (Registered DIMMs). The MT53D384M32D2DS-053 XT:C TR has an integrated thermal solution, featuring direct heat spreaders and advanced cooling technology, ensuring maximum reliability when installed in computers and servers.

The MT53D384M32D2DS-053 XT:C TR is designed for mission-critical applications, including servers, storage systems, industrial computing and financial services. It is specifically designed to provide dependable, high-performance computing with increased reliability and robustness. The MT53D384M32D2DS-053 XT:C TR also offers low-voltage support and reduced power consumption, providing improved power savings and better system performance.

As several layers of memory are integrated into the MT53D384M32D2DS-053 XT:C TR, the memory\'s read/write speed is incredibly fast. It also features Error Correction Code (ECC) which allows the memory to detect and repair errors due to signal noise, vibrations or temperature changes. The MT53D384M32D2DS-053 XT:C TR also has built-in data protection with die-level redundancy, allowing for complete protection of the stored data.

The MT53D384M32D2DS-053 XT:C TR\'s most innovative aspect is its thermal re-staggering feature. This feature allows for a better distribution of heat throughout the memory, reducing memory cell damage due to thermal stress. Heat sensors located throughout the memory detect areas of increased heat, and directions from a control unit then re-stagger the data stored on the memory, reducing the chances of cell damage by re-distributing the heat.

The MT53D384M32D2DS-053 XT:C TR also features an advanced power-on reset mechanism. This ensures that all the cells in the memory are powered on simultaneously, ensuring consistency and uniformity when the system is turned on. This reduces the chances of data corruption due to single cells being powered-on out of order or experiencing any errors due to voltage spikes or drops.

In conclusion, the MT53D384M32D2DS-053 XT:C TR is a robust and reliable memory solution for mission-critical applications. Its innovative thermal re-staggering feature, power-on reset mechanism, ECC and integrated data protection technologies ensure maximum reliability and data protection. It is designed for high-performance computing and its low-voltage support and reduced power consumption provide improved power savings. The MT53D384M32D2DS-053 XT:C TR is an ideal choice for mission-critical applications requiring a reliable and dependable memory solution.

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