OMNI-UNI-18-50 Allicdata Electronics
Allicdata Part #:

345-1486-ND

Manufacturer Part#:

OMNI-UNI-18-50

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK 18X50MM TO-247 TO-264
More Detail: Heat Sink TO-247, TO-264 Aluminum Board Level, Ve...
DataSheet: OMNI-UNI-18-50 datasheetOMNI-UNI-18-50 Datasheet/PDF
Quantity: 540
1 +: $ 3.57840
10 +: $ 3.48453
25 +: $ 3.39016
50 +: $ 3.20191
100 +: $ 3.01354
250 +: $ 2.82517
500 +: $ 2.73100
1000 +: $ 2.44848
Stock 540Can Ship Immediately
$ 3.94
Specifications
Series: OmniKlip™
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-247, TO-264
Attachment Method: Clip, Solder Foot
Shape: Rectangular, Fins
Length: 1.969" (50.00mm)
Width: 0.710" (18.03mm)
Diameter: --
Height Off Base (Height of Fin): 1.500" (38.10mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of advanced electronic applications remains a significant challenge for many engineering firms; requiring reliable, efficient and cost effective solutions. The OMNI-UNI-18-50 application field and working principle offers such a solution. Used extensively in applications which require heat to be dissipated quickly and quietly, it provides high-quality heat sinks for electronic components.

The OMNI-UNI-18-50 is design to provide more efficient cooling and extended product life in diverse industrial and consumer product applications. Its construction comprises extruded aluminum heat sinks which are fill with a custom-made, high-performance heat-dissipating material, providing consistent heat dissipation over a wide range of operating temperatures. This synchronized process renders the heat sinks lighter, easier to install and significantly more reliable and efficient than other traditional cooling methods.

The OMNI-UNI-18-50’s design also make it very versatile in application. Its cooling method has been proven to increase equipment lifespan up to thirty percent in most cases. Moreover, its flexibility in sensor locations enables maximum heat removal with a minimal footprint. This makes it ideal for use in applications requiring limited space or high heat removal rates.

The OMNI-UNI-18-50’s thermodynamic properties and advanced designs mean greater efficiency, better performance, greater durability and reduced cost. In addition, its complete range of air movement systems, and patented air flow control technology allows the heat generated by sensitive electronic components to be dissipated quickly and quietly.

The OMNI-UNI-18-50\'s design allows for a variety of installation options, making it suitable for practically any environment. Its low weight, small size and high thermal performance also make it an ideal choice for high-altitude applications, where a traditional fan-based cooling system would prove to be impractical.

The OMNI-UNI-18-50 application field and working principle provide an elegant solution to thermal management challenges. With its low installation and maintenance costs, its high-quality construction and its advanced technology, this product and cooling method offers a cost-effective and reliable thermal management solution for the most demanding of applications.

The specific data is subject to PDF, and the above content is for reference

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