OMNI-UNI-27-50

Series:	OmniKlip™
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220, TO-247, TO-264
Attachment Method:	Clip, Solder Foot
Shape:	Rectangular, Fins
Length:	1.969" (50.00mm)
Width:	1.063" (27.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.969" (50.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks: OMNI-UNI-27-50 Application Field and Working Principle

Thermal - Heat Sinks are common components in various types of electronic devices. This article will discuss the application field and working principle of the OMNI-UNI-27-50, a specialized thermally efficient heat sink. Specifically, it will discuss the benefits of choosing the OMNI-UNI-27-50, its application field, and how it works. The OMNI-UNI-27-50 is a popular choice for thermal management for any electronic device as it offers superior performance. Its innovative design enables it to deliver 95+ W/m3 effective thermal dissipation with a low thermal resistance. Its superior thermal performance maximizes the cooling efficiency of the device, allowing for greater reliability and improved longevity. Additionally, the OMNI-UNI-27-50 is incredibly versatile, with a wide range of applications. It is suitable for high-power, highly-integrated PCBs, as well as CPU, GPUs, and other electronic components. The heat sink is also suitable for various ambient temperatures, from -25°C to +170°C. The working principle of the OMNI-UNI-27-50 is quite simple and relies on basic principles of thermodynamics. Heat sinks are designed to draw heat away from the processor and dissipate it into the environment. The OMNI-UNI-27-50 works by using a combination of micro-fins, heat pipes, and flat plates to draw heat away from the heat source and dissipate it into the air. The heat is then cooled by the airflow and expelled from the device. The OMNI-UNI-27-50 is designed to ensure maximum cooling efficiency. Its innovative design utilizes micro-fins on the flat plates to increase the surface area of the heat sink, which in turn increases the device’s ability to draw heat away from the source. Additionally, the heat pipes are designed to continually create an airflow around the fins, which helps to cool the processor and expel the heat from the device. The OMNI-UNI-27-50 is a versatile and reliable heat sink. Its superior thermal performance enables it to effectively cool any electronic device, while its robust construction ensures its longevity and reliability. The combination of micro-fins, heat pipes, and flat plates enable it to draw heat away from the source and effectively dissipate it into the environment. With its wide range of applications, the OMNI-UNI-27-50 is the ideal choice for any Thermal Management solution.

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