OMNI-UNI-30-25-D Allicdata Electronics
Allicdata Part #:

345-1573-ND

Manufacturer Part#:

OMNI-UNI-30-25-D

Price: $ 1.94
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK TO-247 TO-264 TO-220
More Detail: Heat Sink TO-220, TO-247, TO-264 Aluminum Board L...
DataSheet: OMNI-UNI-30-25-D datasheetOMNI-UNI-30-25-D Datasheet/PDF
Quantity: 494
1 +: $ 1.76400
10 +: $ 1.71864
25 +: $ 1.67227
50 +: $ 1.57928
100 +: $ 1.48642
250 +: $ 1.39351
500 +: $ 1.34705
1000 +: $ 1.20770
5000 +: $ 1.18448
Stock 494Can Ship Immediately
$ 1.94
Specifications
Series: OmniKlip™
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220, TO-247, TO-264
Attachment Method: Clip, Solder Foot
Shape: Rectangular, Fins
Length: 0.984" (25.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 2.362" (60.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal Heat Sinks are a type of advanced technology that is used to dissipate heat by transferring it away from a heat-generating power source to a cooler location. The OMNI-UNI-30-25-D is an important model of heat sink that can be used for a wide range of applications. This article will discuss the different applications for the OMNI-UNI-30-25-D, as well as a look at its working principle.

Application Field

The OMNI-UNI-30-25-D heat sink is designed for electronic components and is often used in a wide variety of applications including:

  • Consumer electronics, such as computers, telephones, and digital cameras
  • Industrial electronics, such as equipment used in industrial processes
  • Electrical control systems, such as automation control and power converters
  • Medical imaging and other healthcare equipment
  • Audio and video equipment, such as amplifiers and broadcasting systems

In each of these applications, the OMNI-UNI-30-25-D heat sink helps to properly move heat away from the components and prevent them from overheating. Not only will this prolong the lifespan of the components, it also helps prevent expensive damage in the event of an unexpected shutdown.

Working Principle

The OMNI-UNI-30-25-D heat sink works by transferring heat from the heat-generating sources to the sink itself. This is done by conducting the heat from the source to the sink, which is then dissipated to the surrounding air. The sink features a highly efficient design that makes it an excellent choice for dissipating heat.

The sink consists of several parts, including heat pipes, fins, and base plates. The heat pipes are key to the functioning of the heat sink. When heat is applied, the heat pipes are designed to quickly conduct the heat away from the source and towards the sink. The fins are also important in dissipating the heat as quickly as possible, and the base plate helps to transfer the heat from sink to the surrounding air.

The OMNI-UNI-30-25-D is designed to provide superior heat dissipation. This makes it an ideal choice for a wide range of applications where heat must be effectively removed from a device. Additionally, the design also makes it very easy to install and maintain, saving both time and money in the long run.

Conclusion

The OMNI-UNI-30-25-D is an effective heat sink for a wide range of applications. It is designed with superior heat dissipation capabilities which makes it exceptionally efficient at transferring heat away from the heat-generating source. This makes it an ideal choice for many electronic components, especially in consumer electronics, industrial electronics, electrical control systems, medical equipment, and audio/video equipment.

The OMNI-UNI-30-25-D also features an easy-to-install and maintain design, making it an even more desirable choice for those who are looking for an efficient and cost-effective solution for their thermal management needs.

The specific data is subject to PDF, and the above content is for reference

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