Allicdata Part #: | 345-1569-ND |
Manufacturer Part#: |
OMNI-UNI-27-75 |
Price: | $ 3.17 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK TO-247 TO-264 TO-220 |
More Detail: | Heat Sink TO-220, TO-247, TO-264 Aluminum Board L... |
DataSheet: | OMNI-UNI-27-75 Datasheet/PDF |
Quantity: | 440 |
1 +: | $ 2.87910 |
10 +: | $ 2.80161 |
25 +: | $ 2.72588 |
50 +: | $ 2.57443 |
100 +: | $ 2.42304 |
250 +: | $ 2.27161 |
500 +: | $ 2.19588 |
1000 +: | $ 1.96871 |
Series: | OmniKlip™ |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220, TO-247, TO-264 |
Attachment Method: | Clip, Solder Foot |
Shape: | Rectangular, Fins |
Length: | 2.953" (75.00mm) |
Width: | 1.063" (27.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.969" (50.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical issue for many electronic devices, and heat sinks are an essential component in this regard. The OMNI-UNI-27-75 is a type of passive heat sink designed to support low-power electronic devices in achieving thermal stability while providing a small physical footprint. In this article, we discuss the application fields and working principle of the OMNI-UNI-27-75.
Application Fields
The OMNI-UNI-27-75 is designed for use in low-power electronic devices, such as displays and computer systems. Its small size makes it ideal for use in portable devices, which often require the heat sinks to be small and lightweight yet still efficient. The OMNI-UNI-27-75 is also ideal for use in medical and industrial applications where space is at a premium.
Working Principle
The OMNI-UNI-27-75 achieves its thermal performance by utilizing a highly efficient heat transfer material. This heat transfer material, in combination with an aluminum fin design, provides high thermal performance without sacrificing mechanical stability. The aluminum fin design also ensures that heat from the device being cooled does not spread to adjacent components. The OMNI-UNI-27-75 also utilizes a soldered mounting system, which allows for easy installation and removal.
In operation, the OMNI-UNI-27-75 operates on the principle of convection. Heat from the device being cooled is transferred to the fins of the heat sink, which then dissipates the heat to the ambient air. This ensures that the device stays within a safe operating temperature, and as such thermal instability issues can be avoided.
Conclusion
The OMNI-UNI-27-75 is a passive heat sink designed for use in low-power electronic devices. Its small size and efficient design make it ideal for various application fields, where heat sinks need to be small yet still provide effective thermal management. The OMNI-UNI-27-75\'s highly efficient heat transfer material and aluminum fin design ensure that it provides high performance without sacrificing mechanical stability.
The specific data is subject to PDF, and the above content is for reference
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OMNI300NAFTA | Tripp Lite | 0.0 $ | 1000 | UPS 300VA 180W 3OUT TOWER |
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OMNI-UNI-30-25-D | Wakefield-Ve... | 1.94 $ | 494 | HEATSINK TO-247 TO-264 TO... |
OMNI-UNI-34-25 | Wakefield-Ve... | 2.2 $ | 496 | HEATSINK TO-247 TO-264 TO... |
OMNI-UNI-27-50 | Wakefield-Ve... | 2.35 $ | 364 | HEATSINK TO-247 TO-264 TO... |
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