OMNI-UNI-27-75 Allicdata Electronics
Allicdata Part #:

345-1569-ND

Manufacturer Part#:

OMNI-UNI-27-75

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK TO-247 TO-264 TO-220
More Detail: Heat Sink TO-220, TO-247, TO-264 Aluminum Board L...
DataSheet: OMNI-UNI-27-75 datasheetOMNI-UNI-27-75 Datasheet/PDF
Quantity: 440
1 +: $ 2.87910
10 +: $ 2.80161
25 +: $ 2.72588
50 +: $ 2.57443
100 +: $ 2.42304
250 +: $ 2.27161
500 +: $ 2.19588
1000 +: $ 1.96871
Stock 440Can Ship Immediately
$ 3.17
Specifications
Series: OmniKlip™
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220, TO-247, TO-264
Attachment Method: Clip, Solder Foot
Shape: Rectangular, Fins
Length: 2.953" (75.00mm)
Width: 1.063" (27.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.969" (50.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical issue for many electronic devices, and heat sinks are an essential component in this regard. The OMNI-UNI-27-75 is a type of passive heat sink designed to support low-power electronic devices in achieving thermal stability while providing a small physical footprint. In this article, we discuss the application fields and working principle of the OMNI-UNI-27-75.

Application Fields

The OMNI-UNI-27-75 is designed for use in low-power electronic devices, such as displays and computer systems. Its small size makes it ideal for use in portable devices, which often require the heat sinks to be small and lightweight yet still efficient. The OMNI-UNI-27-75 is also ideal for use in medical and industrial applications where space is at a premium.

Working Principle

The OMNI-UNI-27-75 achieves its thermal performance by utilizing a highly efficient heat transfer material. This heat transfer material, in combination with an aluminum fin design, provides high thermal performance without sacrificing mechanical stability. The aluminum fin design also ensures that heat from the device being cooled does not spread to adjacent components. The OMNI-UNI-27-75 also utilizes a soldered mounting system, which allows for easy installation and removal.

In operation, the OMNI-UNI-27-75 operates on the principle of convection. Heat from the device being cooled is transferred to the fins of the heat sink, which then dissipates the heat to the ambient air. This ensures that the device stays within a safe operating temperature, and as such thermal instability issues can be avoided.

Conclusion

The OMNI-UNI-27-75 is a passive heat sink designed for use in low-power electronic devices. Its small size and efficient design make it ideal for various application fields, where heat sinks need to be small yet still provide effective thermal management. The OMNI-UNI-27-75\'s highly efficient heat transfer material and aluminum fin design ensure that it provides high performance without sacrificing mechanical stability.

The specific data is subject to PDF, and the above content is for reference

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