OMNI-UNI-30-50-D

Series:	OmniKlip™
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220, TO-247, TO-264
Attachment Method:	Clip, Solder Foot
Shape:	Rectangular, Fins
Length:	1.969" (50.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	2.362" (60.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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The OMNI-UNI-30-50-D may be classified as a thermal – heat sink component. Thermal – Heat Sinks are engineered components used to dissipate heat from working electronic components. The most common heat sinks are passive, meaning they contain no moving parts to generate air flow. Heat energy is dissipated from the part somewhat evenly through heat conducting, thermal efficient materials and devices.The OMNI-UNI-30-50-D is designed to be used in a variety of application fields. It\'s primary purpose is to control and reduce temperature in electronic systems. The component can be used in a range of consumer electronics, such as computers, game consoles, refrigerators and even automobiles. It can also be used in industrial machinery, robotic equipment and even medical machinery.The OMNI-UNI-30-50-D is made of a combination of thermal conductive materials and fans. The material used varies depending on the intended application, but the most common materials used are aluminum and copper. The fans are predominantly DC motors, which generate air flow to help vent out heat.The OMNI-UNI-30-50-D is designed for applications that require relatively small cooling solutions. It is not designed to be used in applications that require very large cooling solutions, such as data centers. In these types of applications, higher power heat sinks are needed.The OMNI-UNI-30-50-D can typically handle temperatures up to approximately 130˚ F (55˚ C). Higher powered heat sinks can handle temperatures up to approximately 300˚ F (150˚ C).The working principle of the OMNI-UNI-30-50-D is relatively straightforward. It works on the principle of thermodynamics, which governs the transfer of heat energy from hot to cold regions. In the case of the OMNI-UNI-30-50-D, heat energy is transferred from the electronic components to the heat sink. This is done through a combination of thermal conductivity and air flow. The thermal conductivity of the materials used in the heat sink, coupled with the air flow generated by the fan, is used to transfer the heat away from the component.The main advantage of the OMNI-UNI-30-50-D is its relatively low cost. The component is also relatively small and compact, making it ideal for applications that require small cooling solutions.The OMNI-UNI-30-50-D is an effective and cost efficient way to keep electronic components safe and reduce their temperature. Its easy to install design and low cost make it an attractive option for a variety of applications.

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