Allicdata Part #: | QB0805B40ESS3-ND |
Manufacturer Part#: |
QB0805B40ESS3 |
Price: | $ 5.04 |
Product Category: | Fans, Thermal Management |
Manufacturer: | American Technical Ceramics |
Short Description: | THERMAL CONDUCTOR Q-BRIDGE |
More Detail: | Heat Director/Transfer For 0805 Package |
DataSheet: | QB0805B40ESS3 Datasheet/PDF |
Quantity: | 1000 |
25 +: | $ 4.53323 |
Specifications
Series: | Q-Bridge |
Part Status: | Active |
Accessory Type: | Heat Director/Transfer |
For Use With/Related Products: | 0805 Package |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Dreams start from tiny particles, and often they drive the future. Thermal management and heat dissipation are critical factors in improving the performance, reliability and lifespan of electronic components. In the field of thermal management, QB0805B40ESS3 is a highly respected product. It is a top-of-the-line thermal solution that provides outstanding performance and value for electronic components requiring cooling.QB0805B40ESS3, belonging to the Thermal - Heat Sinks category, is a combination of design, engineering, and manufacturing for high-performance heat sink solutions. This product is die-casted with aluminum for superior strength and heat released. It features a four-arm construction made of aluminum wings and fins, holds components firm and secure, and provides reliable cooling and heat transfer.
The working principle of QB0805B40ESS3 can be explained as follows. Heat is generated by the element when it works. This heat is then transferred to the surrounding environment via radiation, convection, and conduction. At the same time, the heat sink and the heat pipe attached on it, which acts as a thermal bridge, can transfer more heat to the heat sink. Heat transferred in this way can be divided into three parts. First, part of the heat is dissipated through radiation, because heat sinks have a larger radiating area than elements. Second, part of the heat is absorbed by the heat pipes, which quickly spreads the heat to the fins of the heat sinks. Finally, the remaining heat is dissipated through the fins.
The structure of QB0805B40ESS3 consists of four wings and nine fins. This design allows the product to fit into a wide variety of applications and can be configured to suit various specific requirements. That is, the wings are adjustable in pitch, radius, and height, which contributes to its outstanding performance. In addition, the production process of QB0805B40ESS3 is advanced. It goes through die-casting, machining, and anodizing, improving its heat transfer performance and performance stability. As a result, it can effectively reduce the operating temperature of the target component and improve its reliability.
The product can be used for applications ranging from computer chips and desktop computers to medical equipment and aerospace components. It is a top choice for those who need fast and efficient thermal management. Its four-arm construction withstands more than 4500 PSI, making it ideal for extreme temperatures. QB0805B40ESS3 is also lightweight, durable, and has a low profile design, making it suitable for direct installation onto congested circuit boards.
With its superior properties and excellent quality, QB0805B40ESS3, as part of the Thermal - Heat Sinks category, is widely used in the field of electronic heat management. It is a cost-effective product that provides outstanding performance and value for electronic components, enabling them to perform more efficiently and reliably. Its extensive applications, extraordinary design, and advanced process make QB0805B40ESS3 the perfect choice for anyone looking for a powerful thermal solution.
The specific data is subject to PDF, and the above content is for reference
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