QB0805B40ESTD Allicdata Electronics
Allicdata Part #:

QB0805B40ESTD-ND

Manufacturer Part#:

QB0805B40ESTD

Price: $ 1.43
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0805 Package
DataSheet: QB0805B40ESTD datasheetQB0805B40ESTD Datasheet/PDF
Quantity: 1000
1000 +: $ 1.28772
Stock 1000Can Ship Immediately
$ 1.43
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0805 Package
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has been an essential part of technology since the dawn of humanity. In recent years, advances in thermal management have been seen due to the increased need for faster, more powerful, and more efficient electronics that generate more heat than their predecessors. The thermal management of these electronic components must be managed in order to keep the components working properly and prevent them from overheating or causing other issues. The QB0805B40ESTD is a Thermal Heat Sink designed to do just that. This thermal heat sink is used to transfer heat from the components to the surrounding air, thus helping to manage the temperature and prevent thermal damage.

The QB0805B40ESTD is a thermal heat sink that utilizes a combination of conduction and convection. Conduction is the transfer of heat through physical contact between two objects; it is an inefficient process as it only heats the material that is directly in contact with the heat source. Convection, on the other hand, is the transfer of heat through the movement of fluids, such as air. While conduction is inefficient when compared to convection, it is still important in applications where very precise heat transfer is required, such as with the QB0805B40ESTD. By utilizing both conduction and convection, the QB0805B40ESTD is able to transfer heat quickly and efficiently.

The QB0805B40ESTD can be used in a variety of applications and is designed to enable efficient and effective thermal management. These thermal solutions are commonly used in high-powered computing applications, such as servers and high-performance computers. In these applications, the thermal heat sink helps to dissipate the high levels of heat generated by the processors and other components, thus helping to prevent an accumulation of heat and potential thermal damage. The QB0805B40ESTD is also a great solution for other electronics, such as LED lighting, because it is capable of effectively transferring heat with minimal power input.

The QB0805B40ESTD thermal heat sink is an effective solution for cooling and managing temperatures in a wide range of applications. This thermal solution utilizes a combination of conduction and convection to quickly and efficiently transfer heat from the components to the surrounding air. This helps to prevent the components from becoming overheated and allows them to run safely and efficiently. This thermal solution is a great choice for applications that require precise and efficient thermal management, such as with servers and LED lighting.

The specific data is subject to PDF, and the above content is for reference

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