V2003W Allicdata Electronics
Allicdata Part #:

AE10779-ND

Manufacturer Part#:

V2003W

Price: $ 0.35
Product Category:

Fans, Thermal Management

Manufacturer: ASSMANN WSW Components
Short Description: HEAT SINK BLK ANOD ALUM TO-220
More Detail: Heat Sink TO-220 Aluminum Board Level
DataSheet: V2003W datasheetV2003W Datasheet/PDF
Quantity: 876
1 +: $ 0.31500
10 +: $ 0.30114
25 +: $ 0.28602
50 +: $ 0.27859
100 +: $ 0.27481
250 +: $ 0.25598
500 +: $ 0.24091
1000 +: $ 0.21833
5000 +: $ 0.21080
Stock 876Can Ship Immediately
$ 0.35
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 0.748" (19.00mm)
Width: 0.866" (22.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.433" (11.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 30.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are devices that effectively absorb and dissipate excess heat away from sensitive components. The V2003W is a thermal heat sink designed to provide maximum heat transfer from one object to another. The device has a unique construction of aluminum and stainless steel layers which maximize the absorption of heat and keeps components at their optimal operating temperature.

The V2003W consists of a series of fins composed of a cooler material such as aluminum or steel. These fins absorb the excess heat that is generated by components through conduction and convection. The fins then dissipate the heat away from the source of the heat. This prevents the component from overheating, as well as maintaining the temperature of the surrounding environment.

The construction of the V2003W is designed to create maximum surface area, where the fins are able to maximize their transfer of heat away from the source component into the cooler environment. This design also reduces noise, which is beneficial for components that are sensitive to noise. The overall design of the V2003W is highly efficient and can withstand extreme temperatures. It is also capable of providing 6x better heat transfer than conventional heat sinks.

The V2003W thermal heat sink is most commonly used in high-power, high-temperature applications such as solid state drives, CPUs, GPUs, and other components that are exposed to extreme temperatures. It is also well-suited for applications in the automotive industry, due to its ability to endure high temperatures and provide efficient cooling. The device has also been used in the industrial sector for its ability to efficiently dissipate heat away from high-powered components.

The working principle of the V2003W is simple. The device uses a highly efficient heat transfer method to quickly remove heat from components such as CPUs, GPUs, and other electronic components. This is done by transferring the heat from the source through conduction and convection into the fins of the heat sink. The fins then dissipate the heat away from the source, thus cooling the component. The fins also act as a barrier between the component and external sources of heat.

The V2003W thermal heat sink is a highly efficient device that provides enhanced cooling performance in high temperature and high power applications. It is designed with a unique layer of aluminum and steel that maximizes heat transfer away from the source. The device is capable of 6x better heat transfer than conventional heat sinks and is known for its ability to endure extreme temperatures. It is well-suited for applications in the automotive, electronics, and industrial sectors due to its efficient heat transfer capabilities.

The specific data is subject to PDF, and the above content is for reference

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