V5640A-T Allicdata Electronics
Allicdata Part #:

AE10900-ND

Manufacturer Part#:

V5640A-T

Price: $ 0.29
Product Category:

Fans, Thermal Management

Manufacturer: ASSMANN WSW Components
Short Description: HEATSINK ALUM ANOD
More Detail: Heat Sink TO-220 Aluminum Board Level, Vertical
DataSheet: V5640A-T datasheetV5640A-T Datasheet/PDF
Quantity: 326
1 +: $ 0.27090
10 +: $ 0.25704
25 +: $ 0.24419
50 +: $ 0.23776
100 +: $ 0.23455
250 +: $ 0.21848
500 +: $ 0.20563
1000 +: $ 0.18635
5000 +: $ 0.17993
Stock 326Can Ship Immediately
$ 0.29
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Shape: Rectangular, Fins
Length: 1.340" (34.04mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 20.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The heat sink V5640A-T is a thermal system component used for electronic device cooling. It is designed to spread out excess heat from electronic components generated during normal operation. Heat sinks, combined with cooling fans, can help regulate and decrease the temperature of these components, thus promoting continuous and consistent performance with minimal failure.

The V5640A-T features a unique pinfin structure with dual outcut portions along the entire surface area. The pinfins dissipate heat quickly by allowing higher air flow and helps to draw out hot air, while the curved edges of the fins help improve the heat sinking effect even further. Additionally, the V5640A-T is designed to be thicker than conventional pinfins to ensure the desired cooling performance.

The V5640A-T heat sink is constructed using high purity aluminum alloy. This alloy has excellent thermal conductivity and its extended outcut structure makes it well suited for applications that require rapid cooling such as multi-core processors and graphics cards. The circular pinfin design of the V5640A-T also offers a larger contact area between the heat-generating component and the heat sink, which in turn helps reduce the temperature differential between the two and achieve better cooling performance.

The V5640A-T heat sink also comes with a die-casted frame. This frame provides extra rigidity and stability, minimizing any bending or warping due to frequent temperature changes. The heat sink includes a mounting bracket and thermal grease that can be used to secure the heat sink in place and ensure optimal performance.

The V5640A-T heat sink is most commonly used for cooling CPUs, GPUs, power transistors and power ICs. It can be used to dissipate heat from any kind of discrete component as it is able to work with a wide range of fan RPMs. The V5640A-T heat sink has proven to be an effective way to cool high-powered components by drawing the heat away from the component itself and allowing it to escape efficiently.

The V5640A-T heat sink is an excellent solution for high-powered electronic applications. With its high-grade material, large contact area, die-casted frame and extra-wide fins, the V5640A-T heat sink is able to efficiently eliminate heat and maintain optimum temperatures in all kinds of high-powered electronic components.

The specific data is subject to PDF, and the above content is for reference

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