V5642B-T Allicdata Electronics
Allicdata Part #:

AE10895-ND

Manufacturer Part#:

V5642B-T

Price: $ 0.44
Product Category:

Fans, Thermal Management

Manufacturer: ASSMANN WSW Components
Short Description: HEATSINK ALUM ANOD
More Detail: Heat Sink TO-220 Aluminum Board Level, Vertical
DataSheet: V5642B-T datasheetV5642B-T Datasheet/PDF
Quantity: 38
1 +: $ 0.40320
10 +: $ 0.38556
25 +: $ 0.36641
50 +: $ 0.35671
100 +: $ 0.35186
250 +: $ 0.32773
500 +: $ 0.30845
1000 +: $ 0.27953
5000 +: $ 0.26989
Stock 38Can Ship Immediately
$ 0.44
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Shape: Rectangular, Fins
Length: 2.185" (55.50mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 14.00°C/W
Material: Aluminum
Material Finish: Tin
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A heat sink is a device which is designed to dissipate and conduct heat away from an electronic device, such as a processor. It is typically attached to a processor or a component to ensure that temperatures remain within acceptable limits. The V5642B-T thermal heat sink is a superior solution for cooling and managing heat generated by electronic systems. It is suitable for a variety of applications, from graphic cards to servers and embedded systems.

The V5642B-T incorporates advanced design features to offer unparalleled heat sinks efficiency. Its unique folded fin design increases the surface area, making it able to maximize cooling capability while minimizing the size of the heat sink. The V-shaped design with louvers and smooth airflow ensures cooling performance is increased and the heat is distributed evenly.

The V5642B-T also features a highly efficient heat conduction system. The heat generated by the system is quickly absorbed into the aluminum housing components. Heat is then conducted away, which helps to reduce the temperature of the system. This feature ensures better overall stability and improved longevity of electronic components.

The V5642B-T is also engineered to be energy-efficient. It is designed to draw energy only when in use and to reduce power consumption when idle. This ensures that components are protected against potential problems due to overheating. The fanless design of the V5642B-T also eliminates noise, making it suitable for use in both personal computers and servers.

The working principle of the V5642B-T is based on the direct contact of several layers of heat-conducting material at the contact points. This ensures that heat generated in the electronic components is rapidly spread to the layers of metal material incorporated in the structure of the device. The heat is then dispersed away from the contact points, and then conducted away from the V5642B-T and into the surrounding environment.

The integral cooling system of the V5642B-T also helps to ensure that the heat sink remains cool and is not subjected to unnecessary overheating. The integrated fan offers superior cooling performance, without generating high levels of noise. Furthermore, the fan is designed to draw air from the interior of the chassis. This ensures that the heat generated by the V5642B-T is efficiently dispersed into the environment.

The V5642B-T thermal heat sink is a reliable and efficient solution for cooling and managing heat generated by electronic systems. Its unique folded fin design ensures optimized performance and energy-saving features, while the highly efficient heat conduction system helps to reduce temperature. Together with its integral cooling system and fanless design, the V5642B-T offers superior performance in cooling and managing heat.

The specific data is subject to PDF, and the above content is for reference

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