V5641B-T Allicdata Electronics
Allicdata Part #:

AE10896-ND

Manufacturer Part#:

V5641B-T

Price: $ 0.32
Product Category:

Fans, Thermal Management

Manufacturer: ASSMANN WSW Components
Short Description: HEATSINK ALUM ANOD
More Detail: Heat Sink TO-220 Aluminum Board Level, Vertical
DataSheet: V5641B-T datasheetV5641B-T Datasheet/PDF
Quantity: 1204
1 +: $ 0.28980
10 +: $ 0.27594
25 +: $ 0.26208
50 +: $ 0.25528
100 +: $ 0.25181
250 +: $ 0.23456
500 +: $ 0.22075
1000 +: $ 0.20006
5000 +: $ 0.19316
Stock 1204Can Ship Immediately
$ 0.32
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Shape: Rectangular, Fins
Length: 1.410" (35.81mm)
Width: 0.878" (22.30mm)
Diameter: --
Height Off Base (Height of Fin): 0.252" (6.40mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 21.00°C/W
Material: Aluminum
Material Finish: Tin
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The V5641B-T Thermal - Heat Sink range is designed specifically to provide maximum efficiency within a small form factor, making them ideal for applications where space is limited. Made from aluminum, their copper cores are anodized for superior thermal conductivity and strength, providing up to 95 percent thermal efficiency. These heat sinks have a low weight, enabling easy installation with any mounting hardware.

The V5641B-T Thermal - Heat Sink range is designed for efficient heat transfer and effective thermal management, which is especially important for electronics that generate excess heat. It is well suited to applications such as automotive, LED lighting, solar cells and other applications. With a compact design and high efficiency, it provides excellent cooling and thermal management.

The working principle of the V5641B-T Thermal - Heat Sink is based on convection. Heat transfers to the fins of the heat sink from the heat source, such as a CPU, via conduction. The fins then dissipate the heat into the atmosphere by radiation and convection. The heat is dissipated, cooled, and pulled away from the heat source, preventing any overheating.

The V5641B-T Thermal - Heat Sink is designed to provide superior performance while keeping the form factor and weight to a minimum. Each heat sink is rigorously tested to ensure maximum thermal efficiency and reliability. It is also designed to be robust and reliable even under the most extreme conditions. Additionally, its installation is simple and hassle-free, making it suitable for both DIY and professional use.

The V5641B-T Thermal - Heat Sink is an excellent choice for both professionals and DIY users alike. Its efficient cooling and maximum thermal conductivity provides a superior experience. With its robust construction and easy installation, it is a reliable and low maintenance option for any application. Whether you need it for your home projects or for professional use, the V5641B-T Thermal - Heat Sink is the perfect choice.

The specific data is subject to PDF, and the above content is for reference

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