XC2S50-6FG256C

Series:	Spartan®-II
Part Status:	Active
Number of LABs/CLBs:	384
Number of Logic Elements/Cells:	1728
Total RAM Bits:	32768
Number of I/O:	176
Number of Gates:	50000
Voltage - Supply:	2.375 V ~ 2.625 V
Mounting Type:	Surface Mount
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	256-BGA
Supplier Device Package:	256-FBGA (17x17)
Base Part Number:	XC2S50

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IntroductionA Field Programmable Gate Array (FPGA) is a type of embedded system that has reconfigurable logic gates. An FPGA board is quite similar to an integrated circuit (IC), but differs in its ability to be reconfigured after manufacture. XC2S50-6FG256C is an example of a FPGA from the Xilinx family.Benefits of FPGAsFPGAs provide several advantages when compared to ICs and other types of embedded systems. The primary benefit of FPGAs is the ability to quickly and easily customize and configure logic gates for the desired application. This provides a great deal of flexibility and reduces the cost of development. In addition, FPGAs are also well-suited for applications that require high speed and responsiveness. The XC2S50-6FG256C is designed for high-performance devices and provides a range of features such as a low power delta delay adjustment and a new generation of static reconfiguration. Another benefit of FPGAs is that they can quickly adapt to changes in their environment or other external inputs. For example, if a system relies on data from external sensors, FPGAs can compute data at a much faster rate than traditional ICs can. This flexibility is especially useful in mission critical applications, where even small delays or changes in conditions could cause catastrophic results.The last benefit of FPGAs is their low power consumption. When compared to traditional ICs, FPGAs tend to consume less power. This is because FPGAs only take up the space required for their logic structure and don’t require additional power for inactive elements.Features of the XC2S50-6FG256CThe XC2S50-6FG256C is a FPGA from the Xilinx family. It is designed for high-performance embedded devices and features a low power delta delay adjustment and a new generation of static reconfiguration. The XC2S50-6FG256C is equipped with 256 Macrocells and 4 megabits of SRAM. It is constructed using advanced 14 nm silicon technology and offers low static power consumption. It also provides enhanced system reliability with hot-swap capability for multiple voltage islands.The XC2S50-6FG256C also offers excellent connectivity with support for high-speed UARTs, RS-485, and USB 2.0. It provides an onboard 32-bit processor with ARM® Cortex®-A9 processor. Its advanced analog Mixed-Signal (MS) system provides 12-bit A/D and D/A converters, audio and low power capability for remote monitoring and diagnosis.In addition, the XC2S50-6FG256C also offers configurable on-chip peripherals such as GPIO, SPI, Quada/I2C, and advanced dual 10G Ethernet. It also offers a wide range of debug options, including JTAG, trace port, and remote debug using Ethernet. With a configurable on-chip non-volatile memory, the XC2S50-6FG256C provides an intelligent low power control solution.ConclusionThe XC2S50-6FG256C is an example of a Field Programmable Gate Array from the Xilinx family. It offers a number of features such as256 Macrocells and 4 megabits of SRAM, advanced analog Mixed-Signal (MS) system, configurable on-chip peripherals, and wide range of debug options. With its flexibility, performance and low power consumption, the XC2S50-6FG256C is an ideal solution for high-performance embedded devices.

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