XC3S1200E-5FTG256C Allicdata Electronics
Allicdata Part #:

XC3S1200E-5FTG256C-ND

Manufacturer Part#:

XC3S1200E-5FTG256C

Price: $ 44.20
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 190 I/O 256FTBGA
More Detail: N/A
DataSheet: XC3S1200E-5FTG256C datasheetXC3S1200E-5FTG256C Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status:
Moisture Sensitivity Level (MSL):
1 +: $ 44.20000
10 +: $ 42.87400
100 +: $ 41.99000
1000 +: $ 41.10600
10000 +: $ 39.78000
Stock 1000Can Ship Immediately
$ 44.2
Specifications
Series: Spartan®-3E
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 2168
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 19512
Total RAM Bits: 516096
Number of I/O: 190
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)
Base Part Number: XC3S1200E
Description

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The XC3S1200E-5FTG256C is a field programmable gate array (FPGA) device from Xilinx. It is a member of the Spartan-3E family of devices and is targeted for cost-sensitive applications that require low cost and low power capabilities. The device incorporates the latest Xilinx Spartan-3E FPGA technology and provides high-density logic, excellent system performance, and low power consumption.

The XC3S1200E-5FTG256C offers several features to reduce overall system cost, such as on-chip non-volatile memory, versatile I/O options, advanced clocking resources, and integrated system power-management capabilities. The device functions as a highly flexible logic engine that can be used to implement a variety of digital signal processing, microcontroller, or mixed-signal designs.

XC3S1200E-5FTG256C features 256 I/O pins, two banks of DDR memory interface, four clock management tiles, two PowerPC405 microcontrollers, and up to four independent ARM8 soft-core microcontrollers. The device is supported by Xilinx’s suite of software tools, including the Xilinx Platform Studio for development and the ChipScope Pro for system debug and monitoring.

The XC3S1200E-5FTG256C is ideal for embedded applications in the industrial, military, and aerospace markets. Its low power and small footprint make it well-suited to a broad range of hand-held devices and other portable systems. Additionally, its low cost and high level of integration make it well-suited for emerging markets and applications that have size, weight, and power constraints.

The XC3S1200E-5FTG256C is easy to use for embedded designers thanks to its robust programming and configuration system. The device can be programmed and configured using a variety of third-party and Xilinx tools, including Xilinx’s own iMPACT design software, which provides a user-friendly and powerful design environment. The programming and configuration process is straightforward, allowing designers to quickly implement complex and sophisticated designs.

The XC3S1200E-5FTG256C is a highly capable device that combines versatility, low power consumption, and low cost in an easy-to-use package. The device offers a simple yet powerful platform for implementing embedded designs, and is the perfect choice for low-cost, low-power applications in the industrial, military, and aerospace markets.

The specific data is subject to PDF, and the above content is for reference

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