XC3S1400AN-5FGG676C Allicdata Electronics
Allicdata Part #:

122-1600-ND

Manufacturer Part#:

XC3S1400AN-5FGG676C

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 502 I/O 676FBGA
More Detail: N/A
DataSheet: XC3S1400AN-5FGG676C datasheetXC3S1400AN-5FGG676C Datasheet/PDF
Quantity: 119
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)
Stock 119Can Ship Immediately
Specifications
Series: Spartan®-3AN
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 2816
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 25344
Total RAM Bits: 589824
Number of I/O: 502
Number of Gates: 1400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)
Base Part Number: XC3S1400AN
Description

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FPGAs (Field Programmable Gate Arrays) are computer controllers designed to be highly efficient and programmable, greatly reducing the costs associated with the development and running of complex mechanical and industrial systems. XC3S1400AN-5FGG676C is a powerful FPGA solution from Xilinx Inc, specifically designed to meet the needs of embedded applications in a wide range of industries.

XC3S1400AN-5FGG676C is a highly integrated FPGA device which includes a 663 bit memory and multiple IO peripheral controllers. The device offers up to 150 MHz full-duplex serial communication channel, supporting both the I2C and SPI standards. The DSP Extension Kit provides an embedded DSP processor for digital signal processing applications. The board also includes a pair of analog-to-digital converters for audio and video input, and is able to support a variety of multimedia formats.

XC3S1400AN-5FGG676C is designed to be a flexible solution, supporting a wide range of development platforms and operating systems including embedded Linux, Microsoft Windows and Real Time Operating Systems (RTOSes). The board also features a wide range of interfaces and peripheral connectors, including Ethernet, USB, serial ports and I2C. This makes the board ideal for use in both commercial and industrial applications.

The XC3S1400AN-5FGG676C is designed to offer exceptional performance and power efficiency in complex embedded applications. It features Xilinx\'s powerful Virtex-6 architecture, with up to 432 Gbps of on-chip memory bandwidth, up to 6.4 Gbps of external memory bandwidth, up to 2.4 Gbps of DSP bandwidth, and up to six clock cycles of latency, allowing for fast and efficient execution of algorithms in industrial computing scenarios. Additionally, the device includes advanced power-saving features, providing low power operation up to 0.5 W of power consumption, and allowing for long battery life operation in mobile and embedded devices.

XC3S1400AN-5FGG676C is a powerful and highly integrated FPGA solution, offering an ideal combination of features, performance and power efficiency for complex embedded applications. Its low-power capabilities make it ideal for use in mobile and industrial location-specific applications, while its easy-to-use development suite and broad range of peripherals and connectors make it suitable for use in a wide range of development and manufacturing environments.

The specific data is subject to PDF, and the above content is for reference

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