XC3S700A-4FGG400C Allicdata Electronics
Allicdata Part #:

122-1548-ND

Manufacturer Part#:

XC3S700A-4FGG400C

Price: $ 2.29
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 311 I/O 400FBGA
More Detail: N/A
DataSheet: XC3S700A-4FGG400C datasheetXC3S700A-4FGG400C Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status:
Moisture Sensitivity Level (MSL):
1 +: $ 2.29000
10 +: $ 2.22130
100 +: $ 2.17550
1000 +: $ 2.12970
10000 +: $ 2.06100
Stock 1000Can Ship Immediately
$ 2.29
Specifications
Series: Spartan®-3A
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 1472
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Number of Gates: 700000
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)
Base Part Number: XC3S700A
Description

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An FPGA, or Field Programmable Gate Array, is an integrated circuit composed of programmable logic blocks and other resources such as outputs, power, and I/O. XC3S700A-4FGG400C is a specific type of FPGA manufactured by Xilinx. This FPGA is a high-density, low-power, and high-performance device capable of implementing a broad range of embedded applications.

The XC3S700A-4FGG400C FPGA has many features that make it suitable for embedded applications. It has a high performance, large capacity, and high-speed logic array. The device also supports IEEE 1149.1 JTAG interface, which is a standard debugging mechanism used in development processes. Additionally, it supports a wide range of I/O standards including LVDS, LVTTL, ALTLVDS, SSTL2, and SSTL3. It also has a low-voltage memory controller, a user-programmable memory core, and embedded system IP cores such as PCI Express, Xilinx MicroBlaze, and PowerPC.

The XC3S700A-4FGG400C is also Windows-Latched FPGA technology, which makes it suitable for high-performance embedded applications. The device provides system level integration and features PowerPC and Xilinx MicroBlaze processors. It also provides on-chip signal processing for high bandwidth systems, supporting up to 64 I/O pins. The device’s power management features include power-up and power-down modes, and includes an integrated FPGA-based system Soft Controller, allowing it to be customized for a variety of application requirements.

XC3S700A-4FGG400C also supports a wide range of I/O standards. It has an 8-bit wide LVDS, plus support for SSTL2, SSTL3, ALTLVDS, and other I/O standards. The device also supports a wide range of high-speed I/O protocols, including QDR, RLDRAM, DDR, and USB. It also supports multiple clock domains, and multiple asynchronous interfaces.

The XC3S700A-4FGG400C FPGA is an ideal device to implement a broad range of embedded applications. Its high performance, large capacity, and high-speed logic array make it suitable for high-performance embedded systems. Additionally, its low-voltage memory controller and user-programmable memory core make it suitable for low-power embedded applications. Its high-speed I/O protocols, and its support for multiple clock domains, as well as multiple asynchronous interfaces make it capable of meeting the needs of a variety of embedded applications. Finally, its Windows-Latched FPGA technology makes it suitable for high-performance embedded applications, providing system-level integration of processors, signal processing, and other resources.

The specific data is subject to PDF, and the above content is for reference

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