XC3S50AN-4TQG144C Allicdata Electronics
Allicdata Part #:

122-1555-ND

Manufacturer Part#:

XC3S50AN-4TQG144C

Price: $ 8.25
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 108 I/O 144TQFP
More Detail: N/A
DataSheet: XC3S50AN-4TQG144C datasheetXC3S50AN-4TQG144C Datasheet/PDF
Quantity: 1382
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)
1 +: $ 8.24670
10 +: $ 7.99930
100 +: $ 7.83436
1000 +: $ 7.66943
10000 +: $ 7.42203
Stock 1382Can Ship Immediately
$ 8.25
Specifications
Series: Spartan®-3AN
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 176
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 1584
Total RAM Bits: 55296
Number of I/O: 108
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)
Base Part Number: XC3S50AN
Description

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Field Programmable Gate Array (FPGAs) are integrated circuits that contain an array of reconfigurable logic blocks. They enables flexibility in design and implementation of digital systems with the feature of reprogrammable logic blocks using a hardware description language (HDL) such as Verilog or VHDL. FPGAs are widely used in embedded processors, communications, and high-performance computing applications which offers the benefit of reconfigurable technology.

The Xilinx XC3S50AN-4TQG144C is a Field-Programmable Gate Array (FPGA) device that is capable of delivering a high level of performance in various applications. This FPGA combines the best features of both System-On-Chip (SoC) and Programmable Logic Device (PLD) designs such as embedded memories and fractional clock-rates. It is an ideal solution for applications that require diversified functions and operations.

The Xilinx XC3S50AN-4TQG144C FPGA integrates up to fifty thousand logic elements, sixteen cascadable Multi-Gigabit Transceivers, three Flex-Connect ports, two PowerPC microprocessors, sixteen DSP slices and dedicated Multi-Gigabit Transceivers for high-speed data communication. The high amount of logic elements, DSP slices, memories, and transceivers make it capable for complex algorithms for a variety of applications.

The XC3S50AN-4TQG144C FPGA also features Smart Virtual I/O capabilities and a suite of cores for the implementation of Data Paths and Control Paths. The Data Paths provide support for numerous communication protocols while the Control Paths enable flexible and sophisticated bus architectures such as AMBA and Avalon. This FPGA also provides an integrated power management and can provide a wide range of power options to cope with various performance needs.

The Xilinx XC3S50AN-4TQG144C FPGA is also built to resist high temperatures and vibration, making it suitable for automotive, aerospace, and other embedded applications. Additionally, it features superior signal integrity, allowing for lower power, higher speeds, and longer operating temperature ranges. It is also EMI-safe and has a low standby power consumption.

The Xilinx XC3S50AN-4TQG144C FPGA delivers outstanding performance, flexibility, and scalability. Its superior and powerful architecture makes it ideal for a wide range of high-end applications and solutions. From Data Paths to Control Paths, embedded memories, transceivers and power management, this FPGA provides an ideal choice for embedded applications.

The specific data is subject to PDF, and the above content is for reference

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