| Allicdata Part #: | XC3SD1800A-4FGG676I-ND |
| Manufacturer Part#: |
XC3SD1800A-4FGG676I |
| Price: | $ 216.67 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | Xilinx Inc. |
| Short Description: | IC FPGA 519 I/O 676FBGA |
| More Detail: | N/A |
| DataSheet: |  XC3SD1800A-4FGG676I Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 216.66700 |
| 10 +: | $ 187.77800 |
| 100 +: | $ 151.66700 |
| 1000 +: | $ 144.44400 |
| 10000 +: | $ 137.22200 |
| Series: | Spartan®-3A DSP |
| Part Status: | Active |
| Number of LABs/CLBs: | 4160 |
| Number of Logic Elements/Cells: | 37440 |
| Total RAM Bits: | 1548288 |
| Number of I/O: | 519 |
| Number of Gates: | 1800000 |
| Voltage - Supply: | 1.14 V ~ 1.26 V |
| Mounting Type: | Surface Mount |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Package / Case: | 676-BGA |
| Supplier Device Package: | 676-FBGA (27x27) |
| Base Part Number: | XC3SD1800A |
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Field programmable gate array (FPGA) technology has made huge advancements over the past decade, and the new Xilinx XC3SD1800A-4FGG676I is at the forefront of that evolution. This particular device is a high-performance, high-density FPGA designed for applications in embedded systems, and it offers an unprecedented level of computational power, features, and flexibility.
Overview
The Xilinx XC3SD1800A-4FGG676I is an advanced FPGA based on a 16 nanometer (nm) process. It boasts a total of 1800K system logic cells, with up to 144K block RAM (BRAM). It has over 2800 user I/Os, as well as over 1180 digital signal processing (DSP) slices which can each handle two multiplies and two additions per clock cycle. This device is surrounded by special function I/Os, clocking resources, three global clock networks, and multiple power islands for efficient power management.
The Xilinx XC3SD1800A-4FGG676I supports diverse applications such as embedded processing and control, signal processing, image/video processing, Internet-of-Things (IoT) applications, artificial intelligence (AI), and 5G wireless communications.
Application Fields
The Xilinx XC3SD1800A-4FGG676I is suitable for a wide range of applications in fields such as consumer electronics, industrial controls, medical electronics, and automotive. It offers excellent performance in embedded systems applications due to its high-density and high-performance architecture. It is also an ideal choice for low-power, low-cost, high-performance embedded processing projects.
The device is suitable for implementing complex algorithms, such as those found in predictive industrial control, intelligent imaging, and advanced automotive systems. Its performance, feature set, and scalability make it ideal for creating complex applications with high-throughput, low-latency control in fields such as industrial control and automotive. Its highly programmable nature is also beneficial for projects requiring frequent code updates.
Furthermore, the device is well-suited for applications requiring significant computational power, such as image and video processing, AI, and 5G wireless communications. The integrated DSP slices can be used to implement a variety of intensive computational tasks. The device also offers multiple power islands, global clock networks, and a wide range of I/O options to support the most demanding designs.
Working Principle
The working principle of the Xilinx XC3SD1800A-4FGG676I FPGA is based on the same basic concept as other FPGAs. All FPGAs are composed of numerous interconnected logic cells, which can be programmed to implement specific algorithms. The user creates a design by "programming" or configuring a series of logic cells to create logic functions or modules. The logic modules can then be interconnected to form a complete circuit design.
The Xilinx XC3SD1800A-4FGG676I takes this concept further by offering a higher degree of scalability and flexibility than other FPGAs. It features a large number of logic cells, BRAM, and I/Os, allowing users to create complex applications with higher efficiency and performance. Its multiple power islands, global clock networks, and digital signal processing slices also make it well-suited for projects requiring intense computation.
Furthermore, the device utilizes a low-power, high-performance architecture and supports a variety of technologies, including AI, 5G wireless communications, and multiple processor architectures. This makes it ideal for applications requiring both high-performance and low-power operation.
Conclusion
The Xilinx XC3SD1800A-4FGG676I is a powerful, high-density FPGA based on a 16nm process. It is an ideal choice for embedded systems and other applications requiring intensive computational capabilities, such as those found in predictive industrial control, intelligent imaging systems, AI applications, and 5G wireless communications. The device is well-suited for projects requiring frequent code updates and extensive scalability, making it a perfect choice for embedded applications.
The specific data is subject to PDF, and the above content is for reference
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