XC3SD3400A-4FG676I Allicdata Electronics
Allicdata Part #:

XC3SD3400A-4FG676I-ND

Manufacturer Part#:

XC3SD3400A-4FG676I

Price: $ 113.51
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 469 I/O 676FBGA
More Detail: N/A
DataSheet: XC3SD3400A-4FG676I datasheetXC3SD3400A-4FG676I Datasheet/PDF
Quantity: 1000
40 +: $ 103.19400
Stock 1000Can Ship Immediately
$ 113.51
Specifications
Series: Spartan®-3A DSP
Part Status: Active
Number of LABs/CLBs: 5968
Number of Logic Elements/Cells: 53712
Total RAM Bits: 2322432
Number of I/O: 469
Number of Gates: 3400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Base Part Number: XC3SD3400A
Description

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FPGAs, or Field Programmable Gate Arrays, are integrated circuits (ICs) that are designed to be configured with customizable logic. The XC3SD3400A-4FG676I FPGA is a high-density device from Xilinx that is suitable for a broad range of embedded applications. This article discusses the applications and working principles of the XC3SD3400A-4FG676I FPGA.

The XC3SD3400A-4FG676I is designed as a single-chip FPGA solution for a wide variety of embedded applications. It features a highly flexible configuration of logic and interconnect resources, which make it suitable for a broad range of applications. The device has a flexible Silicon Genealogy feature and supports a wide range of fabric elements such as embedded processors, RAM blocks, and embedded configuration devices. It is capable of supporting 16-bit and 32-bit processor cores, and provides powerful peripheral support for communication and audio applications.

As with other FPGA devices, the XC3SD3400A-4FG676I employs an internal network of logic elements and programmable interconnects. This means that the device can be configured according to the application in terms of the logic elements, interconnects, and the peripheral support. The logic elements of the device consist of programmable logic arrays (PLAs) and reconfigurable logic elements (RLEs). The PLAs are composed of programmable logic modules and programmable interconnects, and are used to create the logic functions that are required in the application. The RLEs are composed of multiplexers, flip-flops, and registers and provide the logic operations, storage, and control that are necessary.

The XC3SD3400A-4FG676I also offers a wide range of on-chip features. It supports multiple fabrics including embedded systems development, digital signal processing (DSP), high-speed memory, and multidrop serial links. The device also features a variety of digital input/output (I/O) and analog I/O features, as well as programmable I/O configurations. Furthermore, it provides support for multiple interfaces including Gigabit Ethernet and USB.

The working principle of the XC3SD3400A-4FG676I is similar to that of other FPGA devices. A user typically programs the device in order to create the specific logic functions and interconnects that are needed for the application. The user then configures the I/O pins of the device according to the desired functionality. Once the device is programmed it can then be used to implement the desired logic and functionality in the application.

The XC3SD3400A-4FG676I FPGA is an excellent choice for a wide range of embedded applications. It offers a highly flexible configuration of logic elements and interconnects, as well as a variety of on-chip features that make it suitable for a range of digital input/output, analog input/output, communication, and audio applications. Furthermore, the device\'s working principle is similar to that of other FPGAs, and its programmability can be used to easily create tailored logic and functionality for specific applications.

The specific data is subject to PDF, and the above content is for reference

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